MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

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TDK

东电化

SOIC8

Chipanalog川土微

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HTSSOP16

TI

德州仪器

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SOIC-8

Chipanalog川土微

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SOIC-16-300mil

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上传：深圳市禾兴威科技有限公司