MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

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TDK

东电化

HTSSOP16

TI

德州仪器

上传：深圳市金芯世纪电子有限公司

SOP8

CHIPANAL

上传：深圳市恒科翔业电子有限公司

SOIC-16-300mil

Chipanalog(川土微)

上传：深圳市禾兴威科技有限公司

SMD

Canaantek

迦美信

上传：深圳市兴联达电子有限公司(原兴达电子)