丝印：CAA；Package：6LdSC70；Ultra Low ON-Resistance, Low Voltage, Single Supply, SPDT Analog Switch

文件：523.13 Kbytes 页数：10 Pages

RENESAS

瑞萨

丝印：CAAO；Package：QFN-22L；28 V/8 A Synchronous EZBuckTM Regulator

General Description The AOZ1267AQI is a high-efficiency, easy-to-use DC/DC synchronous buck regulator that operates up to 28 V. The device is capable of supplying 8 A of continuous output current with an output voltage adjustable down to 0.6 V ±1. A proprietary constant on-time PWM control wi

文件：1.71786 Mbytes 页数：15 Pages

AOSMD

万国半导体

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化