Surface Mount Zener Diodes

Features ● Planar Die Construction ● Ultra-Small Surface Mount Package ● Ideally Suited for Automated Assembly Processes

文件：48.45 Kbytes 页数：2 Pages

KEXIN

科信电子

丝印：WT；Package：SOD-323；Plastic-Encapsulate Zener Diode

Features ● Low Zener Impedance ● 200mW; Power Dissipation of 200mW ● High Stability and High Reliability

文件：1.11124 Mbytes 页数：5 Pages

LEIDITECH

雷卯电子

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：666.74 Kbytes 页数：4 Pages

SY

顺烨电子

丝印：WT；Package：SOD-323；SURFACE MOUNT ZENER DIODES

FEATURES Planar die construction 200mW power dissipation on ceramic PBC General purpose, medium current Ideally suited for automated assembly processes Available in lead free version

文件：1.00256 Mbytes 页数：5 Pages

SY

顺烨电子

200mW SURFACE MOUNT ZENER DIODE

Features ● Planar Die Construction ● 200mW Power Dissipation ● 2.0V – 51V Nominal Zener Voltage ● 5 Standard Vz Tolerance ● Designed for Surface Mount Application ● Plastic Material – UL Recognition Flammability Classification 94V-0

文件：57.26 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

200mW SURFACE MOUNT ZENER DIODE

Features ● Planar Die Construction ● 200mW Power Dissipation ● 2.0V – 51V Nominal Zener Voltage ● 5 Standard Vz Tolerance ● Designed for Surface Mount Application ● Plastic Material – UL Recognition Flammability Classification 94V-0

文件：49.55 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

SURFACE MOUNT SILICON ZENER DIODES

Features: • Planar Die Construction • 200mW Power Dissipation • 2.4-51V Nominal Zener Voltage • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives • This is a Pb − Free Device • All SMC parts are traceable to the wafer lot • Additional testin

文件：139.31 Kbytes 页数：5 Pages

SMC

桑德斯微电子

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：391.6 Kbytes 页数：4 Pages

CHENDA

辰达半导体

ZENER DIODE

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：945.44 Kbytes 页数：4 Pages

CHENDA

辰达半导体

ZENER DIODE

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：111.17 Kbytes 页数：4 Pages

CHENDA

辰达半导体