SURFACE MOUNT SILICON ZENER DIODES

Features: • Planar Die Construction • 200mW Power Dissipation • 2.4-51V Nominal Zener Voltage • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives • This is a Pb − Free Device • All SMC parts are traceable to the wafer lot • Additional testin

文件：139.31 Kbytes 页数：5 Pages

SMC

桑德斯微电子

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

文件：666.73 Kbytes 页数：4 Pages

SHUNYE

顺烨电子

丝印：WH；Package：SOD-323；SOD-323 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction General Purpose, Medium Current 200mW Power Dissipation On Ceramic PBC Ideally Suited for Automated Assembly Processes Available in Lead Free Version

文件：3.0583 Mbytes 页数：7 Pages

UNSEMI

优恩半导体

Zener Diode in a SOD-323 Plastic Package.

Descriptions Zener Diode in a SOD-323 Plastic Package. Features 200mW Power dissipation, medium current, automated assembly processes. Applications 2.4V to 39V wide zener voltage range applications.

文件：627.15 Kbytes 页数：7 Pages

FOSHAN

蓝箭电子

丝印：WI；Package：SOD-323；Surface Mount Silicon Zener Diodes

FEATURES ● Ideally suited for automated assembly processes. ● Total power dissipation: Max. 200mW

文件：766.12 Kbytes 页数：2 Pages

SKTECHNOLGYSHIKE Electronics

时科广东时科微实业有限公司

丝印：WH；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes

文件：260.47 Kbytes 页数：3 Pages

YIXIN

壹芯微

丝印：WH；Package：SOD-323；Zener Diodes

■ Features ● Planar die construction ● 200mW power dissipation on ceramic PBC ● General purpose, medium current ● Ideally suited for automated assembly processes ● Available in lead free version

文件：1.11581 Mbytes 页数：4 Pages

YFWDIODE

佑风微

Plastic-Encapsulate Diodes

Plastic-Encapsulate Diodes FEATURES Planar die construction General purpose, Medium current Ideally suited for automated assembly processes Available in Lead free version

文件：281.01 Kbytes 页数：3 Pages

HOTTECH

合科泰

丝印：WH；Package：SOD-323；PLASTIC-ENCAPSULATE ZENER DIODE

VOLTAGE 2.0~75 Volts POWER 200.0 mW FEATURES • Low Zener Impedance • Power Dissipation of 200mW • High Stability and High Reliability • Zener Voltage Tolerance: ± 5 MECHANICAL DATA • Case: SOD-123 Small Outline Plastic Package • Epoxy UL: 94V-0 • Polarity: Color band denotes cathode end

文件：1.05048 Mbytes 页数：6 Pages

NIUHANG

纽航电子

Surface mount zener diode

Features • Planar die construction. • General purpose, medium current. • Ideally suited for automated assembly processes. • RoHS compliant package Applications • Zener diode. • Ultra-small surface mount package.SOD-323

文件：480.26 Kbytes 页数：4 Pages

BWTECH