首页 >BTS716G/TR>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
SmartHigh-SidePowerSwitchFourChanmels:4x140m廓StatusFeedback
| InfineonInfineon Technologies AG 英飞凌英飞凌科技股份公司 | Infineon | ||
Veryfasthigh-voltagesoft-recoveryrectifiers DESCRIPTION Ruggedglasspackage,usingahightemperaturealloyedconstruction. Thispackageishermeticallysealedandfatiguefreeascoefficientsofexpansionofallusedpartsarematched. Thepackageisdesignedtobeusedinaninsulatingmediumsuchasresin,oilorSF6gas. FEATU | PhilipsPhilips Semiconductors 飞利浦荷兰皇家飞利浦 | Philips | ||
Veryfasthigh-voltagesoft-recoveryrectifiers | NJSEMINew Jersey Semi-Conductor Products, Inc. 新泽西半导体新泽西半导体产品股份有限公司 | NJSEMI | ||
VectorNetworkAnalyzers | TEKTRONIXTektronix 泰克泰克科技(中国)有限公司 | TEKTRONIX | ||
VectorNetworkAnalyzers | TEKTRONIXTektronix 泰克泰克科技(中国)有限公司 | TEKTRONIX | ||
VectorNetworkAnalyzers | TEKTRONIXTektronix 泰克泰克科技(中国)有限公司 | TEKTRONIX | ||
SmallSignalTransistorPNP-HighVoltageTransistorChip PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize20x20MILS DieThickness9.0MILS BaseBondingPadArea4.0x4.0MILS EmitterBondingPadArea4.7x4.7MILS TopSideMetalizationAl-30,000Å BackSideMetalizationAu-18,000Å | CentralCentral Semiconductor Corp 美国中央半导体 | Central | ||
SmallSignalTransistorsPNP-HighVoltageTransistorChip PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize19.7x19.7MILS DieThickness7.1MILS BaseBondingPadArea4.0x4.0MILS EmitterBondingPadArea4.7x4.7MILS TopSideMetalizationAl-30,000Å BackSideMetalizationAu-18,000Å | CentralCentral Semiconductor Corp 美国中央半导体 | Central | ||
SILICONEPITAXIALPLANARTRANSISTOR(GENERALDESCRIPTION) GENERALDESCRIPTION SiliconNPNhighfrequency,highpowertransistorsinaplasticenvelope,primarilyforuseinaudioandgeneralpurpose | WINGSWing Shing Computer Components 永盛电子永盛电子(香港)有限公司 | WINGS | ||
16-BitDIGITAL-TO-ANALOGCONVERTERwithSerialDataInterface | BURR-BROWN Burr-Brown (TI) | BURR-BROWN |
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