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BST91T1P4K01-VC

Automotive Grade SiC Power Module

Features · HSDIP20 package with the 4th Generation SiC-MOSFET · VDSS = 750V · Low RDS(on) · High-speed switching possible · Low switching losses · Tvjmax = 175°C · Compact design · With high thermal conductivity isolation · Integrated NTC temperature sensor · 4.2kV AC 1s insulation

文件:1.18384 Mbytes 页数:15 Pages

ROHM

罗姆

BST91T1P4K01-VC

HSDIP20, 750V, 90A, 3-Phase-bridge, Automotive / Industrial Grade SiC Power Module

The BST91T1P4K01 is a high-performance SiC molded module rated for 750V, designed with a 6-in-1 structure ideal for PFC and LLC circuits in onboard chargers (OBCs). HSDIP20 features an insulating substrate with excellent heat dissipation properties. This helps maintain a stable chip temperature even • HSDIP20 package with the 4th Generation SiC-MOSFET\n• Low RDS(on)\n• Low switching losses\n• Compact design\n• Integrated NTC temperature sensor\n• 4.2kV AC 1s insulation;

ROHM

罗姆

BSY3-1200/4IOV2

DIP

BYD/比亚迪

BSZ019N03LS

PG-TSDSON-8

Infineon

英飞凌

上传:深圳市威尔健半导体有限公司

BSZ019N03LS

TSDSON-8

INFINEON/英飞凌

上传:深圳市威尔健半导体有限公司

INFINEON/英飞凌

技术参数

  • 封装:

    HSDIP20

  • 包装形态:

    Corrugated Cardboard

  • 包装数量:

    180

  • 最小独立包装数量:

    60

  • RoHS:

    Yes

  • Drain-source Voltage[V]:

    750

  • Drain Current[A]:

    90

  • Total Power Dissipation[W]:

    385

  • Junction Temperature (Max.) [℃]:

    175

  • Storage Temperature (Min.) [℃]:

    -40

  • Storage Temperature (Max.) [℃]:

    125

  • Package:

    3-Phase-bridge

  • Package Size [mm]:

    38.0x31.3 (t=3.5)

  • Common Standard:

    AQG-324

供应商型号品牌批号封装库存备注价格
MOT/PH/ST/SSI
23+
CAN3
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
询价
SHARP
2025+
TSOP
3750
全新原厂原装产品、公司现货销售
询价
SHARP/夏普
2450+
TSOP
9850
只做原装正品现货或订货假一赔十!
询价
TE
25+
100
原厂现货渠道
询价
TE/泰科
2508+
/
320680
一级代理,原装现货
询价
TE8P连接器
2021+
10000
只做原装,可提供样品
询价
国产
2025+
DIP
32000
原装正品现货供应商原厂渠道物美价优
询价
更多BST91T1P4K01-VC供应商 更新时间2025-12-11 17:11:00