| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
BL704 | BL702/BL704/BL706 is highly integrated BLE and zigbee combo chipsets for IoT applications. Features •Wireless –2.4GHzRFtransceiver –Bluetooth®Specificationv5.0 –Bluetooth®LowEnergy1Mbpsand2Mbps –Bluetooth®LongRangeCoded500Kbps and125Kbps –Zigbee3.0,BaseDeviceBehavior,CoreStack R21,GreenPower –IEEE802.15.4MAC/PHY –SupportBLE/zigbeecoexistence | BOUFFALOALBBouffalo Lab Intelligent Technology Co., Ltd. 博流智能博流智能科技（南京）有限公司 | BOUFFALOALB | |
BL702/BL704/BL706 is highly integrated BLE and zigbee combo chipsets for IoT applications. Features •Wireless –2.4GHzRFtransceiver –Bluetooth®Specificationv5.0 –Bluetooth®LowEnergy1Mbpsand2Mbps –Bluetooth®LongRangeCoded500Kbps and125Kbps –Zigbee3.0,BaseDeviceBehavior,CoreStack R21,GreenPower –IEEE802.15.4MAC/PHY –SupportBLE/zigbeecoexistence | BOUFFALOALBBouffalo Lab Intelligent Technology Co., Ltd. 博流智能博流智能科技（南京）有限公司 | BOUFFALOALB | ||
Highvoltagefast-switchingNPNPowerTransistor Description ThedeviceismanufacturedusinghighvoltageMulti-EpitaxialPlanartechnologyforhighswitchingspeedsandmediumvoltagecapability. ItusesaCellularEmitterstructurewithplanaredgeterminationtoenhanceswitchingspeedswhilemaintainingthewideRBSOA. Generalfeatures | STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体集团 | STMICROELECTRONICS | ||
HERMETICALLYSEALEDTO-5CASE [CLAIREX] | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | etc2 | ||
HERMETICALLYSEALEDTO-5CASE [CLAIREX] | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | etc2 | ||
Ultralowphasejitter:0.5ps | RALTRONRaltron Electronics Corporation 拉隆 | RALTRON | ||
SmallSignalTransistorsNPN-AmpSwitchTransistorChip PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize22x22MILS DieThickness9.0MILS BaseBondingPadArea3.7X3.7MILS EmitterBondingPadArea4.2X4.2MILS TopSideMetalizationAl-30,000Å BackSideMetalizationAu-18,000Å | CentralCentral Semiconductor Corp 美国中央半导体 | Central | ||
SmallSignalTransistorsPNP-HighVoltageTransistorChip PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize22x22MILS DieThickness7.1MILS BaseBondingPadArea3.7x3.7MILS EmitterBondingPadArea4.2x4.2MILS TopSideMetalizationAl-30,000Å BackSideMetalizationAu-18,000Å | CentralCentral Semiconductor Corp 美国中央半导体 | Central | ||
4button-downself-calibratingfunctionsolventtouchdetector | LINKAGELinkage Goston Electronics Co., LTD 钲铭科电子深圳市钲铭科电子有限公司 | LINKAGE | ||
POWERDIVIDERS0쨘:4-WAY | SYNERGY Synergy Microwave Corporation | SYNERGY |
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Bouffalo Lab(博流) |
2021+ |
QFN-48 |
3486 |
询价 | |||
BELLING/上海贝岭 |
25+ |
SOP8 |
820000 |
全新原厂原装正品支持实单 |
询价 | ||
SKYWORKS/SILICON LABS(芯科) |
22+ |
DIP-8GW |
78 |
通信接口/百分百原装现货 |
询价 | ||
BL(上海贝岭) |
2025+ |
SOIC-8 |
129270 |
询价 | |||
贝岭 |
2235 |
94 |
询价 |
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