HERMETICALLY SEALED TO-5 CASE

[CLAIREX]

文件：39.29 Kbytes 页数：1 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

HERMETICALLY SEALED TO-5 CASE

[CLAIREX]

文件：39.29 Kbytes 页数：1 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

HERMETICALLY SEALED TO-5 CASE

[CLAIREX]

文件：39.29 Kbytes 页数：1 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

Ultra low phase jitter: 0.5ps

文件：706.24 Kbytes 页数：5 Pages

RALTRON

Small Signal Transistors NPN - Amp Switch Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 22 x 22 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 3.7 X 3.7 MILS Emitter Bonding Pad Area 4.2 X 4.2 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å

文件：133.98 Kbytes 页数：2 Pages

CENTRAL

Small Signal Transistors PNP - High Voltage Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 22 x 22 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.7 x 3.7 MILS Emitter Bonding Pad Area 4.2 x 4.2 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å

文件：475.62 Kbytes 页数：2 Pages

CENTRAL