BL602/BL604 is Wi-Fi BLE combo chipset for ultra-low-cost and low-power application.

文件：854.99 Kbytes 页数：30 Pages

BOUFFALOALB

博流智能

Wi-Fi + BLE 组合的芯片组

BL602/BL604 是一款 Wi-Fi + BLE 组合的芯片组，用于低功耗和高性能应用开发。 \n\n无线子系统包含 2.4G 无线电，Wi-Fi 802.11b/g/n 和 BLE 5.0 基带/MAC 设计。微控制器子系统包含一个低功耗的 32 位 RISC CPU，高速缓存和存储器。电源管理单元控制低功耗模式。此外，还支持各种安全性能。\n\n 外围接口包括 SDIO，SPI，UART，I2C，IR remote，PWM，ADC，DAC，PIR 和 GPIO。 • 2.4GHz 射频收发器 \n• Bluetooth® 低能耗 5.0 支持 BLE 5.0 通道选择＃ 2 不支持 2M PHY /编码 PHY / ADV 扩展 \n• Wi-Fi 安全 WPS/WEP/WPA/WPA2 Personal/WPA2 Enterprise/WPA3 \n• 支持多个云连接 \n• Wi-Fi 和 BLE 共存 \n• 带 FPU（浮点单元）的 32 位 RISC CPU \n• 一个 RTC 计时器一年更新 \n• 四个 DMA 通道 \n• JTAG 开发支持 \n• 276KB RAM \n• 1Kb eFuse \n• 嵌入式 Flash 闪存 (;

Aimachip

机芯智能

BL602/BL604 is Wi-Fi BLE combo chipset for ultra-low-cost and low-power application.

文件：854.99 Kbytes 页数：30 Pages

BOUFFALOALB

博流智能

VOLTAGE 50 to 1000 Volts CURRENT - P.C. MTG 3A , HEAT-SINK MTG 6A

VOLTAGE 50 to 1000 Volts CURRENT - P.C. MTG 3A , HEAT-SINK MTG 6A FEATURES • Plastic package has Underwriters Laboratory Flammability Classification 94V-O. • Surge Overload Ratings to 125 Amperes. • Low forward voltage, and reverse leakage. • Small size , simple installation.

文件：32.34 Kbytes 页数：2 Pages

PANJIT

強茂

DPAK SURFACE MOUNT SUPER FAST RECOVERY RECTIFIER(VOLTAGE - 200 to 600 Volts CURRENT - 6.0 Amperes)

VOLTAGE 200 to 600 Volts CURRENT 6.0 Amperes FEATURES • Superfast recovery times-epitaxial construction. • Low forward voltage, high current capability. • Exceeds environmental standards of MIL-S-19500/228. • Hermetically sealed. • Low leakage. • High surge capability. • Plastic package ha

文件：45.08 Kbytes 页数：2 Pages

PANJIT

強茂

FAST SWITCHING RECOVERY RECTIFIER(VOLTAGE - 50 to 800 Volts CURRENT - 6.0 Amperes)

FEATURES ● Low cost ● Diffused junction ● Low forward voltage drop ● High current capability Fast switching for high efficiency ● The plastic meterial carries U/L recognition 94V-O ● Exceeds environmental standards of MIL-S-19500/228

文件：52.26 Kbytes 页数：2 Pages

PANJIT

強茂