BK10C05-30DPSLASH2-0.3V中文资料广濑数据手册PDF规格书

Features

1. Ultra Low-profile and

Space-saving Design

Compact design ideal for mobile devices.

・ Stacking height : 0.5mm, Pitch : 0.3mm,Depth : 1.7mm

2. Robust Design

Fully armored guides prevent housing damage

due to misalignment when mating.

3. Dimpled Contact Lock Design

for High Extraction Force

Dimpled lock design on power and signal contacts

enables high extraction force.

4. Enhanced PCB Peeling Strength

Both the header and receptacle have 3 solder areas

at each power contact for greater PCB peeling

strength.

5. High Contact Reliability

6. Superior Mating Operability

7. Halogen-Free

Both the power and signal contacts have a two-point

contact design, ensuring high contact reliability.

Wide self-alignment range with metal guides offers

a smooth mating operation.

(±0.29mm in pitch direction, ±0.24mm in width

direction)

Additionally, the clear tactile click generated by the

unique locking contact design ensures complete

mating.

All materials and substances used to produce this

product comply with Halogen-free standards.

* As defined by IEC 61249-2-21

Br : 900ppm max., Cl : 900ppm max.,

Br+Cl : 1,500ppm max.