BK10C05-30DP/2-0.3V连接器互连器件的阵列边缘型夹层式（板对板）规格书PDF中文资料

厂商型号	BK10C05-30DP/2-0.3V
参数属性	BK10C05-30DP/2-0.3V 包装为托盘；类别为连接器互连器件的阵列边缘型夹层式（板对板）；产品描述：CONN HDR 0.3MM SMD 30POS+2PWR
功能描述	0.3mm Pitch, 0.5mm Stacking Height, Fully Armored, Hybrid FPC-to-Board Connector
文件大小	694.65 Kbytes
页面数量	11 页
生产厂商	HIROSE Hirose Electric Company
中文名称	广濑日本广濑电机株式会社
网址	网址
数据手册	下载地址一下载地址二到原厂下载
更新时间	2025-11-27 22:30:00
人工找货	BK10C05-30DP/2-0.3V价格和库存，欢迎联系客服免费人工找货

特性 Features

1. Ultra Low-profile and

Space-saving Design

Compact design ideal for mobile devices.

・ Stacking height : 0.5mm, Pitch : 0.3mm,Depth : 1.7mm

2. Robust Design

Fully armored guides prevent housing damage

due to misalignment when mating.

3. Dimpled Contact Lock Design

for High Extraction Force

Dimpled lock design on power and signal contacts

enables high extraction force.

4. Enhanced PCB Peeling Strength

Both the header and receptacle have 3 solder areas

at each power contact for greater PCB peeling

strength.

5. High Contact Reliability

6. Superior Mating Operability

7. Halogen-Free

Both the power and signal contacts have a two-point

contact design, ensuring high contact reliability.

Wide self-alignment range with metal guides offers

a smooth mating operation.

(±0.29mm in pitch direction, ±0.24mm in width

direction)

Additionally, the clear tactile click generated by the

unique locking contact design ensures complete

mating.

All materials and substances used to produce this

product comply with Halogen-free standards.

* As defined by IEC 61249-2-21

Br : 900ppm max., Cl : 900ppm max.,

Br+Cl : 1,500ppm max.