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CDBFR0140L-HF

SMDSchottkyBarrierDiode

Io=100mA VR=40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, Moldedplastic. -Terminals:Gold

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0140R

SMDSchottkyBarrierDiode

Io=100mA VR=40Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Goldplated

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0140R-HF

SMDSchottkyBarrierDiode

Io=100mA VR=40Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBK0140L

SMDSchottkyBarrierDiode

Io=100mA VR=40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Terminals:Goldplated,solderableperMIL-STD-750,method2026. Case:SOD-123Fstandardpackage

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBK0140R

SMDSchottkyBarrierDiode

Io=100mA VR=40Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-123Fstandardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-7

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQC0140L-HF

SMDSchottkyBarrierDiode

Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction.

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQC0140R-HF

SMDSchottkyBarrierDiode

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQR0140L

SMDSchottkyBarrierDiode

Io=100mA VR=40Volts RoHSDevice Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderable

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQR0140L

SMDSchottkyBarrierDiode

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQR0140L-HF

SMDSchottkyBarrierDiode

COMCHIPComchip Technology

典琦典琦科技股份有限公司

供应商型号品牌批号封装库存备注价格
BI
23+
SOP16
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
询价
500
原装现货
询价
BAY
2138+
BGA
8960
专营BGA,QFP原装现货,假一赔十
询价
EUPEC
23+
MODULE
7300
专注配单,只做原装进口现货
询价
EUPEC
23+
MODULE
7300
专注配单,只做原装进口现货
询价
EUPEC
23+
模块
420
全新原装正品,量大可订货!可开17%增值票!价格优势!
询价
EUPEC/欧派克
2023+
MODULE
225
主打螺丝模块系列
询价
LairdTechnologies
24+
16
询价
LAIRD
24+
原厂原装
4000
原装正品
询价
LAIRD
20+
射频元件
3000
就找我吧!--邀您体验愉快问购元件!
询价
更多BIS0140供应商 更新时间2025-7-25 15:59:00