丝印：BCT756；Package：SOIC；OCTAL BUFFER/DRIVER WITH OPEN-COLLECTOR OUTPUTS

BiCMOS Design Significantly Reduces ICCZ ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Open-Collector Outputs Drive Bus Lines or Buffer Memory Address Registers Package Options Include Plastic Small-Outline Packages (DW) an

文件：563.56 Kbytes 页数：11 Pages

TI

德州仪器

丝印：BCT756；Package：SOIC；OCTAL BUFFER/DRIVER WITH OPEN-COLLECTOR OUTPUTS

BiCMOS Design Significantly Reduces ICCZ ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Open-Collector Outputs Drive Bus Lines or Buffer Memory Address Registers Package Options Include Plastic Small-Outline Packages (DW) an

文件：563.56 Kbytes 页数：11 Pages

TI

德州仪器

ZENER DIODE CHIPS

• 1N746A THRU 1N759A AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/127 • 1N4370A THRU 1N4372A AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/127 • ZENER DIODE CHIPS • 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING • COMPATIBLE WITH ALL WIRE BONDING DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF S

文件：111.73 Kbytes 页数：2 Pages

CDI-DIODE

LEADLESS PACKAGE FOR SURFACE MOUNT

• 1N746AUR-1 THRU 1N759AUR-1 AVAILABLE IN JAN, JANTX AND JANTXV PER MIL-PRF-19500/127 • 1N4370AUR-1 THRU 1N4372AUR-1 AVAILABLE IN JAN, JANTX AND JANTXV PER MIL-PRF-19500/127 • LEADLESS PACKAGE FOR SURFACE MOUNT • METALLURGICALLY BONDED

文件：25.06 Kbytes 页数：2 Pages

CDI-DIODE

SILICON ZENER DIODES

文件：269.49 Kbytes 页数：3 Pages

CDIL