BCM56990数据手册Broadcom中文资料规格书

描述 Description

The Broadcom® BCM56990 family is a class of high-radix, high-bandwidth network switching devices supporting up to 64 × 400GbE, 128 × 200GbE, 256 × 100GbE, 256 × 40GbE, 256 × 25GbE, or 256 × 10GbE ports. The device family features a maximum of 64 integrated Blackhawk7 SerDes cores, each with eight integrated 56 Gb/s PAM4 SerDes transceivers and associated PCS for native support of numerous physical connectivity options, enabling a broad range of media, speed, and reach. The BCM56990 delivers high-bandwidth, glueless network connectivity up to 25.6 Tb/s on a single chip.
The BCM56990 is a high-performance and high-capacity device designed to meet the requirements for next-generation data center and cloud computing environments. The BCM56990 architecture delivers complete L2 and L3 switching, routing and tunneling capabilities at line rate and maximum port density, with low power and latency. Software compatibility is maintained across the StrataXGS® product portfolio to simplify customer designs and reduce customer time-to-market.

特性 Features

• Enables the next generation of high-throughput, low latency hyperscale networks with sixty-four ports of 400GbE switching and routing
• Support for 256 ports of 100GbE ports, enabling low-latency, single-hop networks for massive alternative compute clusters
• Robust connectivity using 512 instances of the industry’s highest performance and longest-reach 50G PAM4 SerDes core, enabling long-reach (LR) East-West optical links and Direct-Attached-Copper (DAC) in-rack cabling in the data center
• The industry’s most advanced 25.6Tbps shared-buffer architecture, offering up to 5X higher incast absorption and providing the highest performance and lowest end-to-end latency for RoCEv2 workloads
• New advanced load balancing mechanisms, virtually eliminating hash polarization and providing extremely efficient, controllable link utilization
• Advanced congestion management, enabling new traffic management paradigms
• Industry-leading instrumentation including IFA 2.0 for inband telemetry, postcards for out-of-band telemetry, SerDes link quality meters, and visibility into all on-chip packet drops and congestion events
• Four 1 GHz ARM processors for high-bandwidth, fully-programmable streaming telemetry and sophisticated embedded applications such as on-chip statistics summarization
• Implemented with unparalleled power efficiency in a monolithic 7nm die

应用 Application

• Single-chip solution for data center aggregation and spine switches
• Data center fixed and chassis/modular switches
• Deep learning networks
• NVMe storage disaggregation