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BCM56870数据手册集成电路(IC)的控制器规格书PDF

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厂商型号

BCM56870

参数属性

BCM56870 包装为托盘;类别为集成电路(IC)的控制器;产品描述:3.2T 32X100G MULTI LAYER SWITCH

功能描述

High-Capacity StrataXGS® Trident 3 Ethernet Switch Series

制造商

Broadcom Broadcom Corporation.

中文名称

博通公司 博通半导体

数据手册

下载地址下载地址二

更新时间

2025-8-7 15:16:00

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BCM56870规格书详情

描述 Description

Server interfaces in the enterprise and service provider data centers are starting to transition from 10 to 25GbE. At the same time SDN is taking hold in these market segments, bringing with it many new requirements such as novel overlays, instrumentation and telemetry. Trident 3 introduces dataplane programmability and 25 Gbps SerDes into the industry-leading Trident™ line to address these evolving markets.  

With support for up to 32 ports of 100GbE, the StrataXGS® Trident 3 switch series can be used to build highly scalable, low-power, feature-rich Top-of-Rack (ToR), Aggregation and Spine switches. The programmable pipeline allows new features to be added after deployment by means of in-field upgrade, providing capex investment protection for operators. Trident 3 programmability enables the latest, cloud-scale instrumentation and telemetry features, for example in-band telemetry. Trident 3 programmability can also be used to add new software-defined forwarding and database reconfiguration features. 
 
In addition, fabrics of BCM56870 devices can be interconnected via the HiGig2™ protocol to support multi-terabit chassis designs for large-scale data center, enterprise and service provider applications. The StrataXGS Trident 3 switch with integrated FleXGS™ Programmability technology has been designed to address performance, capacity and service requirements for next-generation data centers and cloud computing applications.

特性 Features

·Fully programmable dataplane allows introduction of new features via in-field upgrade
·Support for new overlays and tunneling such as GENEVE, NSH, VXLAN, GPE, MPLS, MPLS over GRE/UDP,
GUE, ILA and PPPoE
·Up to 128x 25G integrated SerDes with CL 74, CL 91
and CL 108 FEC
·New instrumentation features such as timestamping, trace captures and Inband Telemetry
·32MB of on-chip fully shared packet buffer
·Dynamic Load Balancing enhances ECMP
·Large, programmable on-chip forwarding databases for L2 switching, L3 routing, label switching, and overlay forwarding
·3X increased ACL scale to support evolving policy/security requirements
·PCIe Gen3 x4 host CPU interface with on-chip accelerators improves control-plane update and boot performance by up to 5X
·Programmable support for enhanced network telemetry, including per-packet timestamping, Flow Tracker, microburst detection, latency/drop monitor, Active-probe-based in-band network telemetry, and in-band OAM processing; integrated with open-source BroadView v2 telemetry agent and analytics software
·Adaptive Routing for dynamic traffic engineering in non-Clos topologies
·Full feature compatibility with previous generation Trident 2 and Trident 2+ devices

技术参数

  • 制造商编号

    :BCM56870

  • 生产厂家

    :Broadcom

  • Distrib. Inventory

    :No

供应商 型号 品牌 批号 封装 库存 备注 价格
Broadcom(博通)
24+
-
6000
全新原厂原装正品现货,低价出售,实单可谈
询价
BROADCOM
22+
NA
20
原装正品支持实单
询价
Broadcom Limited
25+
-
9350
独立分销商 公司只做原装 诚心经营 免费试样正品保证
询价
23+
TSSOP
7300
专注配单,只做原装进口现货
询价
BROADCOM
23+
BGA
7000
询价
23+
TSSOP
7300
专注配单,只做原装进口现货
询价
最新
2000
原装正品现货
询价
BROADCOM
2447
BGA
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价
BROADCOM
23+
BGA
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
BROADCOM
24+
BGA
7850
只做原装正品现货或订货假一赔十!
询价