Single-Chip 802.11n Dual-Band 3x3 Wireless Solution

Single-chip 802.11n dual-band 3x3 wireless solution enables Wi-Fi products to support 450 Mb/s data rates and achieves over 600Mb/s (TCP/IP) throughput in simultaneous AP/router configurations.\n By combining expansive wireless capacity with features to improve range, Broadcom's Intensi-fi® chip ena ·65 nanometer CMOS (Complimentary Metal-oxide Semiconductor) PCIe™ design that promotes high integration and low power consumption\n·Range extension features for delivering video, data and media throughout the house\n·Low-density parity-check (LDPC) and space-time block coding (STBC) for boosting ov;

Broadcom

博通

包装：卷带（TR） 类别：RF/IF，射频/中频和 RFID 射频收发器 IC 描述：IC RF TXRX WIFI SGL CHIP LO PCIE

BOARDCOM

博通

STANDARD LED LAMPS(ROUND TYPES)

STANDARD LED LAMPS (ROUND TYPES) Notes: 1. All Dimensions are in millimeters (inches). 2. Tolerance is ±0.25mm (.010²)

文件：1.00341 Mbytes 页数：2 Pages

YSTONE

早安股份

ULTRA BRIGHT LED LAMPS (ROUND TYPES)

文件：1.5053 Mbytes 页数：4 Pages

YSTONE

早安股份

ULTRA BRIGHT LED LAMPS (ROUND TYPES)

文件：1.5053 Mbytes 页数：4 Pages

YSTONE

早安股份