45 V, 100 mA NPN general-purpose transistor

Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to AEC-Q101 and recommended for use in automotive a

文件：260.399 Kbytes 页数：13 Pages

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安世安世半导体(中国)有限公司

丝印：9F；Package：DFN1412D-3；45 V, 100 mA PNP general-purpose transistor

1. General description PNP general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface- Mounted Device (SMD) plastic package with side-wettable flanks. Table 1. Product overview Type number Package Nexperia JEDEC NPN complement: BC857AQC-Q BC847AQC-Q BC857BQC-Q BC847

文件：248.33 Kbytes 页数：13 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：9F；Package：DFN1412D-3；45 V, 100 mA PNP general-purpose transistor

General description PNP general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks. Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joi

文件：248.49 Kbytes 页数：13 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

45 V, 100 mA PNP general-purpose transistor

General description PNP general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks. Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joi

文件：248.49 Kbytes 页数：13 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

45 V, 100 mA PNP general-purpose transistors

PNP general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.\nTable 1. Product overview Type number\n Package\n NPN complement:\n Nexperia\n JEDEC\n BC857AQC-Q\n SOT8009\n MO-340CA\n • High power dissipation capability\n• Suitable for Automatic Optical Inspection (AOI) of solder joint\n• Smaller footprint compared to conventional leaded SMD packages\n• Low package height of 0.5 mm\n• Qualified according to AEC-Q101 and recommended for use in automotive applications;

Nexperia

安世

Package：3-XDFN 裸露焊盘；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个 描述：TRANS PNP 45V 0.1A DFN1412D-3

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司