首页 >BC847B-TP(MCC)>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
45VNPNSMALLSIGNALTRANSISTORINSOT523 Features BVCEO>45V IC=100mACollectorCurrent EpitaxialPlanarDieConstruction Ultra-SmallSurfaceMountPackage TotallyLead-Free&FullyRoHSCompliant(Notes1&2) HalogenandAntimonyFree.“Green”Device(Note3) QualifiedtoAEC-Q101StandardsforHighReliability | DIODESDiodes Incorporated 美台半导体 | DIODES | ||
NPNSurfaceMountSmallSignalTransistor150mW Features •Halogenfreeavailableuponrequestbyaddingsuffix-HF •LeadFreeFinish/RoHSCompliant(PSuffixdesignates RoHSCompliant.Seeorderinginformation) •EpitaxialDieConstruction •ComplementaryPNPTypeAvailable(BC857AT,BT,CT) •Ultra-SmallSurfaceMountPackage •Epoxy | MCCMicro Commercial Components 美微科美微科半导体股份有限公司 | MCC | ||
NPNDUALSMALLSIGNALSURFACEMOUNTTRANSISTOR Features ●EpitaxialDieConstruction ●ComplementaryPNPTypeAvailable(BC857BV) ●Ultra-SmallSurfaceMountPackage ●LeadFreeByDesign/RoHSCompliant(Note3) | DIODESDiodes Incorporated 美台半导体 | DIODES | ||
NPN/NPNmatcheddoubletransistors Generaldescription NPN/NPNmatcheddoubletransistorsinsmallSurface-MountedDevice(SMD)plasticpackages.Thetransistorsarefullyisolatedinternally. Features ■Currentgainmatching ■Base-emittervoltagematching ■Drop-inreplacementforstandarddoubletransistors Applications ■ | PhilipsPhilips Semiconductors 飞利浦荷兰皇家飞利浦 | Philips | ||
NPNPlastic-EncapsulateTransistors Features •EpitaxialDieConstruction •ComplementaryPNPTypeAvailable(BC857BV) •Ultra-smallSurfaceMountPackage •LeadFreeFinish/RoHSCompliant(PSuffixdesignatesRoHSCompliant.Seeorderinginformation) •EpoxymeetsUL94V-0flammabilityrating •MoisureSensitivityLevel1 • | MCCMicro Commercial Components 美微科美微科半导体股份有限公司 | MCC | ||
Plastic-EncapsulateTransistors FEATURES *EpitaxialDieConstruction *ComplementaryPNPTypeAvailable(BC857BV) *Ultra-SmallSurfaceMountPackage | SECOSSeCoS Halbleitertechnologie GmbH 喜可士喜可士股份有限公司 | SECOS | ||
NPNPlastic-EncapsulateTransistors | MCCMicro Commercial Components 美微科美微科半导体股份有限公司 | MCC | ||
DUALTRANSISTOR(NPN) FEATURES ●EpitaxialDieConstruction ●ComplementaryPNPTypeAvailable(BC857BV) ●Ultra-SmallSurfaceMountPackage | HTSEMIShenzhen Jin Yu Semiconductor Co., Ltd. 金誉半导体深圳市金誉半导体股份有限公司 | HTSEMI | ||
DUALTRANSISTOR(NPNNPN) DUALTRANSISTOR(NPN+NPN) FEATURES ●EpitaxialDieConstruction ●ComplementaryPNPTypeAvailable(BC857BV) ●Ultra-SmallSurfaceMountPackage | JIANGSUJiangsu Changjiang Electronics Technology Co., Ltd 长电科技江苏长电科技股份有限公司 | JIANGSU | ||
NPNPlastic-EncapsulateTransistors Features ◇Halogenfreeavailableuponrequestbyaddingsuffix-HFEpitaxialDieConstruction ◇ComplementaryPNPTypeAvailable(BC857BV) ◇Ultra-smallSurfaceMountPackage ◇LeadFreeFinish/RoHSCompliant(PSuffixdesignates ◇RoHSCompliant.Seeorderinginformation) ◇EpoxymeetsUL | LUGUANGShenzhen Luguang Electronic Technology Co., Ltd 鲁光电子深圳市鲁光电子科技有限公司 | LUGUANG |
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