丝印：A2；Package：DFN1110D-3；45 V, 100 mA NPN general-purpose transistor

Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to AEC-Q101 and recommended for use in automotive a

文件：241.47 Kbytes 页数：13 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

45 V, 100 mA PNP general-purpose transistor

Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to AEC-Q101 and recommended for use in automotive a

文件：245.2 Kbytes 页数：13 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

45 V, 100 mA NPN general-purpose transistor

NPN general-purpose transistor in an ultra small DFN1110D-3 (SOT8015) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.\nTable 1. Product overview Type number\n Package\n PNP complement:\n Nexperia\n JEDEC\n BC847AQB-Q\n SOT8015\n MO-340BA\n • High power dissipation capability\n• Suitable for Automatic Optical Inspection (AOI) of solder joint\n• Smaller footprint compared to conventional leaded SMD packages\n• Low package height of 0.5 mm\n• AEC-Q101 qualified;

Nexperia

安世

Package：3-XDFN 裸露焊盘；包装：散装 类别：分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个 描述：SMALL SIGNAL BIPOLAR IN DFN PACK

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司