45 V, 500 mA NPN general-purpose transistors

General description 500 mA NPN general-purpose transistors in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads. Features and benefits ■ General-purpose transistor ■ Two current gain selections ■ Low package hei

文件：211.14 Kbytes 页数：15 Pages

恩XP

丝印：110100；Package：DFN1010D-3；45 V, 500 mA NPN general-purpose transistors

Features and benefits * General-purpose transistor * Two current gain selections * Low package height of 0.37 mm * AEC-Q101 qualified

文件：879.72 Kbytes 页数：15 Pages

NEXPERIA

安世

Package：3-XDFN 裸露焊盘；包装：散装 类别：分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个 描述：TRANS NPN 45V 0.5A DFN1010D-3

Nexperia USA Inc.

45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • AEC-Q101 qualified

文件：317.37 Kbytes 页数：14 Pages

NEXPERIA

安世

45 V, 500 mA NPN general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • AEC-Q101 qualified

文件：320.55 Kbytes 页数：14 Pages

NEXPERIA

安世

45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • High-temperature appli

文件：315.28 Kbytes 页数：13 Pages

NEXPERIA

安世