45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • AEC-Q101 qualified

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丝印：9M；Package：DFN1412D-3；45 V, 500 mA NPN general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • AEC-Q101 qualified

文件：323.59 Kbytes 页数：14 Pages

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45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • High-temperature appli

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丝印：8V；Package：DFN1412D-3；45 V, 500 mA NPN general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • High-temperature appli

文件：320.95 Kbytes 页数：13 Pages

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丝印：9M；Package：DFN1412D-3；45 V, 500 mA NPN general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to

文件：334.75 Kbytes 页数：14 Pages

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45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to

文件：332.46 Kbytes 页数：14 Pages

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Discrete and MOSFET components, analog & logic ICs

文件：11.62183 Mbytes 页数：234 Pages

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45 V, 500 mA NPN general-purpose transistors

NPN general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.\nTable 1. Product overview Type number\n Package\n PNP complement:\n Name\n JEDEC\n Version\n BC817-16QC\n DFN1412D-3\n  • High power dissipation capability\n• Three current gain selections\n• Smaller footprint compared to conventional leaded SMD packages\n• AEC-Q101 qualified;

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45 V, 500 mA NPN general-purpose transistors

NPN general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.\nTable 1. Product overview Type number\n Package\n PNP complement\n Name\n JEDEC\nVersion BC817-16QCH-Q\nDFN1412D-3 MO-340CA\n • High power dissipation capability\n• Three current gain selections\n• Smaller footprint compared to conventional leaded SMD packages\n• High-temperature applications up to 175 °C\n• Qualified according to AEC-Q101 and recommended for use in automotive applications;

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45 V, 500 mA NPN general-purpose transistors

NPN general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.\nTable 1. Product overview Type number\n Package\n PNP complement\n Name\n JEDEC\nVersion BC817-16QC-Q\nDFN1412D-3 MO-340CA\n • High power dissipation capability\n• High current\n• Three current gain selections\n• Suitable for Automatic Optical Inspection (AOI) of solder joint\n• Smaller footprint compared to conventional leaded SMD packages\n• Low package height of 0.5 mm\n• AEC-Q101 qualified;

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