BC53PAS-Q中文资料安世数据手册PDF规格书

1. General description

PNP medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D)

leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and

visible and solderable side pads.

2. Features and benefits

• High collector current capability IC and ICM

• Reduced Printed-Circuit Board (PCB) area requirements

• Exposed heat sink for excellent thermal and electrical conductivity

• Two current gain selections

• Leadless very small SMD plastic package with medium power capability

• Suitable for Automatic Optical Inspection (AOI) of solder joint

• Qualified according to AEC-Q101 and recommended for use in automotive applications

3. Applications

• Linear voltage regulators

• Battery driven devices

• MOSFET drivers

• High-side switches

• Power management

• Amplifiers