SMD transformer for ultrasonic sensors

Features  Qualification: AEC-Q200  Resistance to reflow soldering heat in accordance to JEDEC J-STD-020E with Tpeak = +245 °C  MSL level 1  RoHS compatible Applications  Ultrasonic Sensor  Ultrasonic Park Assist  Industrial distance measuring  Robotics

文件：246.77 Kbytes 页数：7 Pages

TDK

东电化

SMD transformer for ultrasonic sensors

Features  Qualification: AEC-Q200  Resistance to reflow soldering heat in accordance to JEDEC J-STD-020E with Tpeak = +245 °C  MSL level 1  RoHS compatible Applications  Ultrasonic Sensor  Ultrasonic Park Assist  Industrial distance measuring  Robotics

文件：246.77 Kbytes 页数：7 Pages

TDK

东电化

SMD transformer for ultrasonic sensors

Features  Qualification: AEC-Q200  Resistance to reflow soldering heat in accordance to JEDEC J-STD-020E with Tpeak = +245 °C  MSL level 1  RoHS compatible Applications  Ultrasonic Sensor  Ultrasonic Park Assist  Industrial distance measuring  Robotics

文件：246.77 Kbytes 页数：7 Pages

TDK

东电化

SMD transformer for ultrasonic sensors

Features  Qualification: AEC-Q200  Resistance to reflow soldering heat in accordance to JEDEC J-STD-020E with Tpeak = +245 °C  MSL level 1  RoHS compatible Applications  Ultrasonic Sensor  Ultrasonic Park Assist  Industrial distance measuring  Robotics

文件：246.77 Kbytes 页数：7 Pages

TDK

东电化

SMD transformer for ultrasonic sensors

Features  Qualification: AEC-Q200  Resistance to reflow soldering heat in accordance to JEDEC J-STD-020E with Tpeak = +245 °C  MSL level 1  RoHS compatible Applications  Ultrasonic Sensor  Ultrasonic Park Assist  Industrial distance measuring  Robotics

文件：246.77 Kbytes 页数：7 Pages

TDK

东电化

SMD Transformers

Features  Height: 11.6 mm max  Footprint: 16.2 mm x 13.4 mm  Plastic Bobbin CTI IIIa class material  Wide temperature range from –40 °C up to +150 °C  Qualified to AEC-Q200  RoHS compatible Applications  Isolated DC/DC converters

文件：785.89 Kbytes 页数：12 Pages

TDK

东电化

Quickstart Manual for EVAL KIT HPD G1 SiC

The evaluation kit EVAL KIT HPD G1 SiC is a partial inverter system including B6 bridge power module, gate driver board, DC-link capacitor and cooler. The evaluation kit supports the customers in their first steps in designing applications with the HybridPACK™ Drive CoolSiC™.

文件：941 Kbytes 页数：13 Pages

INFINEON

英飞凌

Gate Driver Board

The evaluation gate driver board HPD GD BOARD G1 SiC is an isolated six-channel gate driver board dedicated for the evaluation purpose of HybridPACK™ Drive CoolSiC™ modules. It comes with Infineon automotive EiceDRIVERTM gate driver ICs. The evaluation gate driver board supports the customers in

文件：1.57727 Mbytes 页数：20 Pages

INFINEON

英飞凌

SMD Transformers

Features  Height: 11.6 mm max  Footprint: 16.2 mm x 13.4 mm  Plastic Bobbin CTI IIIa class material  Wide temperature range from –40 °C up to +150 °C  Qualified to AEC-Q200  RoHS compatible Applications  Isolated DC/DC converters

文件：785.89 Kbytes 页数：12 Pages

TDK

东电化

SMD Transformers

Features  Height: 11.6 mm max  Footprint: 16.2 mm x 13.4 mm  Plastic Bobbin CTI IIIa class material  Wide temperature range from –40 °C up to +150 °C  Qualified to AEC-Q200  RoHS compatible Applications  Isolated DC/DC converters

文件：785.89 Kbytes 页数：12 Pages

TDK

东电化