丝印：B2；Package：SOD-923F；SMD Schottky Barrier Diode

Features - Designed for mounting on small surface. - Extremely thin package. - Low stored charge. - Majority carrier conduction. - AEC-Q101 Qualified.

文件：472.09 Kbytes 页数：4 Pages

COMCHIP

典琦

丝印：B2；Package：SOT26；GREEN MODE PWM CONTROLLER

Features - Very Low Start-Up Current - Current Mode Control - Non-Audible-Noise Green-Mode Control - Internal Slope Compensation - Soft Start during Startup Process - Frequency Fold Back for High Average Efficiency - Secondary Winding Short Protection with FOCP - Soft Switching (Soft Drive

文件：412.02 Kbytes 页数：13 Pages

DIODES

美台半导体

丝印：B2；Package：DFN1006；1-Line Bi-directional TVS Diode

Features Ultra small package: 1.0x0.6x0.5mm Ultra low capacitance: 15pF typical Ultra low leakage: nA level Low operating voltage: 5V Low clamping voltage 2-pin leadless package Complies with following standards: – IEC 61000-4-2 (ESD) immunity test Air discharge: ±30kV Contact discharge:

文件：1.81496 Mbytes 页数：4 Pages

LEIDITECH

雷卯电子

丝印：B2；Package：DFN1006；1-Line Bi-directional TVS Diode

Features Ultra small package: 1.0x0.6x0.5mm Ultra low capacitance: 15pF typical Ultra low leakage: nA level Low operating voltage: 5V Low clamping voltage 2-pin leadless package Complies with following standards: – IEC 61000-4-2 (ESD) immunity test Air discharge: ±30kV Contact discharge:

文件：1.83839 Mbytes 页数：4 Pages

LEIDITECH

雷卯电子

丝印：B2；Package：DFN1006；1-Line Bi-directional TVS Diode

Features Ultra small package: 1.0x0.6x0.5mm Ultra low capacitance: 15pF typical Ultra low leakage: nA level Low operating voltage: 5V Low clamping voltage 2-pin leadless package Complies with following standards: – IEC 61000-4-2 (ESD) immunity test Air discharge: ±30kV Contact discharge:

文件：2.050469 Mbytes 页数：4 Pages

LEIDITECH

雷卯电子

丝印：B2；Package：SOD-123；1A Surface Mount Schottky Barrier Rectifiers

■ Features • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. • Suffix G indicates Halogen-f

文件：89.63 Kbytes 页数：3 Pages

CITC

竹懋科技

丝印：B2；Package：SOD123F；Single high-voltage switching diode

1.1 General description Single high-voltage switching diode, encapsulated in a SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features n Small and flat lead SMD plastic package n Reverse voltage: VR £ 200 V 1.3 Applications n General-purpose switching

文件：875.87 Kbytes 页数：10 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：B2；Package：MO340-BA；45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • AEC-Q101 qualified

文件：317.37 Kbytes 页数：14 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：B2；Package：MO340-BA；45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to

文件：329.51 Kbytes 页数：14 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：B2；Package：SC-62；60 V, 1 A NPN power bipolar transistors

Features and benefits • High collector current capability IC and ICM • Three current gain selections • High power dissipation capability • AEC-Q101 qualified

文件：239.38 Kbytes 页数：12 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司