3.0V to 3.6V 256K X 6 IntelliwattTM low-power CMOS SRAM with one chip enable

文件：215.45 Kbytes 页数：9 Pages

ETCList of Unclassifed Manufacturers

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3.0V to 3.6V 256K X 6 IntelliwattTM low-power CMOS SRAM with one chip enable

文件：215.45 Kbytes 页数：9 Pages

ETCList of Unclassifed Manufacturers

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ULTRA MINIATURE SURFACE MOUNT WATCH CRYSTAL

文件：78.2 Kbytes 页数：1 Pages

FOX

包装：盒 类别：连接器，互连器件 DIN 导轨，通道 描述：SPRING CLAMP 50A600V22-8AWG 8MM

ALTECH

丝印：AS60MM1；Package：PG-TO263-7-HV-ND5.8；Final datasheet CoolSiC™ 1200 V SiC Trench MOSFET : Silicon Carbide MOSFET

Features • VDSS = 1200 V at Tvj = -55...175°C • IDDC = 38 A at TC = 25°C • RDS(on) = 60 mΩ at VGS = 20 V, Tvj = 25°C • New performance-optimized chip technology (Gen1p) with improved RDSon* A • Best in class switching energy for lower switching losses and reduced cooling efforts • Lowest dev

文件：1.66775 Mbytes 页数：16 Pages

INFINEON

英飞凌

丝印：AS641；Package：SOIC；OCTAL BUS TRANSCEIVERS WITH OPEN-COLLECTOR OUTPUTS

Bidirectional Bus Transceivers in High-Density 20-Pin Packages Choice of True or Inverting Logic Package Options Include Plastic Small-Outline (DW) Packages and Standard Plastic (N) 300-mil DIPs description These octal bus transceivers are designed for asynchronous two-way communication

文件：710.82 Kbytes 页数：18 Pages

TI

德州仪器

丝印：AS641；Package：SOIC；OCTAL BUS TRANSCEIVERS WITH OPEN-COLLECTOR OUTPUTS

Bidirectional Bus Transceivers in High-Density 20-Pin Packages Choice of True or Inverting Logic Package Options Include Plastic Small-Outline (DW) Packages and Standard Plastic (N) 300-mil DIPs description These octal bus transceivers are designed for asynchronous two-way communication

文件：710.82 Kbytes 页数：18 Pages

TI

德州仪器

丝印：AS646；Package：SOIC；OCTAL BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS

Independent Registers for A and B Buses Multiplexed Real-Time and Stored Data Choice of True or Inverting Data Paths Choice of 3-State or Open-Collector Outputs Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (NT) and Ceramic (J

文件：462.32 Kbytes 页数：25 Pages

TI

德州仪器

丝印：AS646；Package：SOIC；OCTAL BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS

Independent Registers for A and B Buses Multiplexed Real-Time and Stored Data Choice of True or Inverting Data Paths Choice of 3-State or Open-Collector Outputs Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (NT) and Ceramic (J

文件：462.32 Kbytes 页数：25 Pages

TI

德州仪器

丝印：AS652；Package：SOIC；OCTAL BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS

Bus Transceivers/Registers Independent Registers and Enables for A and B Buses Multiplexed Real-Time and Stored Data Choice of True or Inverting Data Paths Choice of 3-State or Open-Collector Outputs to A Bus description These devices consist of bus-transceiver circuits, D-type flip-flo

文件：583.92 Kbytes 页数：31 Pages

TI

德州仪器