Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC

Features ƒ Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM memory support up to 32 GB ƒ Option 9-36V power module compatible with all-in-one ordering ƒ Optional modular design for 2.5 hard drive bays: in

文件：928.51 Kbytes 页数：3 Pages

ADVANTECH

研华科技

Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC

Features ƒ Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM memory support up to 32 GB ƒ Option 9-36V power module compatible with all-in-one ordering ƒ Optional modular design for 2.5 hard drive bays: in

文件：928.51 Kbytes 页数：3 Pages

ADVANTECH

研华科技

Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC

Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC ·Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor\n\n·Triple independent display: VGA + HDMI + Optional Display\n\n·DDR4 SO-DIMM memory support up to 32 GB\n\n·Option 9-36V power module compatible with all-in-one ordering\n\n·Optional modular design for 2.5\" hard drive bays: internal ;

Advantech

研华科技

Headphone amplifier with internal LPF and EVR for CD-ROM

The BA3530FS is an H / P amplifier with internal secondary LPF and EVR circuits. When multibit output from a D / A converter is input, the secondary LPF outputs an audio signal. The amplifier circuit allows for line output and headphone output. The output level for headphones can be changed with t

文件：77.12 Kbytes 页数：6 Pages

ROHM

罗姆

DDR-SDRAM Termination Regulator

文件：185.87 Kbytes 页数：2 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

Surface Mount Package Reflow Process Compatible Low Phase Noise Build in PLL-Circuit

文件：169.22 Kbytes 页数：6 Pages

VECTRON