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CD3024

MultilevelPipelineRegisters

TheAm29520AandAm29521Aarehigh「speeddualstack, registerfiesthatdifleronlyinthewaydataisloaded(see Table1)-Bothdevicescontainfour8-bitwideregisters whosetexiblearchitecturelendsitseiftovirtuallyany System,Thehighoutputdriveallowslayoutofthedevices dire

AMDAdvanced Micro Devices

超威半导体美国超威半导体公司

CD3024B

1WATTCAPABILITYWITHPROPERHEATSINKING

•1N3016BTHRU1N3045BAVAILABLEINJANHCPERMIL-PRF-19500/115 •1WATTCAPABILITYWITHPROPERHEATSINKING •ALLJUNCTIONSCOMPLETELYPROTECTEDWITHSILICONDIOXIDE •COMPATIBLEWITHALLWIREBONDINGANDDIEATTACHTECHNIQUES,WITHTHEEXCEPTIONOFSOLDERREFLOW

CDI-DIODE

Compensated Deuices Incorporated

CDLL3024B

1WATTZENERDIODES

•1N3016BUR-1thru1N3045BUR-1AVAILABLEINJAN,JANTXANDJANTXV PERMIL-PRF-19500/115 •1WATTZENERDIODES •LEADLESSPACKAGEFORSURFACEMOUNT •DOUBLEPLUGCONSTRUCTION •METALLURGICALLYBONDED

CDI-DIODE

Compensated Deuices Incorporated

CHA3024-QGG

2-22GHzLNAwithAGC

UMS

United Monolithic Semiconductors

CZRA3024

SurfaceMountZenerDiode

Features -Forsurfacemountedapplicationsinordertooptimizeboardspace -Lowprofilepackage -Built-instrainrelief -Glasspassivatedjunction -Lowinductance -Excellentclampingcapability -TypicalIlessthan1uAabove11VD -Hightemperaturesoldering260°C/10secondsat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CZRB3024

SurfaceMountZenerDiode

Features -Forsurfacemountedapplicationsinordertooptimizeboardspace -Lowprofilepackage -Built-instrainrelief -Glasspassivatedjunction -Lowinductance -Excellentclampingcapability -TypicalIDlessthan1uAabove11V -Hightemperaturesoldering260°C/10secondsatt

COMCHIPComchip Technology

典琦典琦科技股份有限公司

DME3024

SiliconBeam-LeadandChipSchottkyBarrierMixerDiodes

ETCList of Unclassifed Manufacturers

未分类制造商

DMN3024LSD

30VDUALN-CHANNELENHANCEMENTMODEMOSFET

DIODESDiodes Incorporated

美台半导体

DMN3024LSS

30VN-CHANNELENHANCEMENTMODEMOSFET

DIODESDiodes Incorporated

美台半导体

DMN3024SFG

30VN-CHANNELENHANCEMENTMODEMOSFETPOWERDI짰

DIODESDiodes Incorporated

美台半导体

产品属性

  • 产品编号:

    AP3024PP

  • 制造商:

    Hammond Manufacturing

  • 类别:

    盒子,外壳,机架 > 机架组件

  • 系列:

    APPP

  • 包装:

    散装

  • 类型:

    面板 - 内部

  • 大小 / 尺寸:

    26.000" 长 x 22.500" 宽(660.40mm x 571.50mm)

  • 颜色:

    灰色

  • 材料:

    金属 - 钢

  • 配套使用/相关产品:

    N1A 系列

  • 通风:

    通风

  • 描述:

    STEEL INNER PANEL

供应商型号品牌批号封装库存备注价格
Hammond
2020+
N/A
155
加我qq或微信,了解更多详细信息,体验一站式购物
询价
Hammond
22+
NA
155
加我QQ或微信咨询更多详细信息,
询价
BCDSEMI
23+
NA
19960
只做进口原装,终端工厂免费送样
询价
N/A
23+
80000
专注配单,只做原装进口现货
询价
N/A
23+
80000
专注配单,只做原装进口现货
询价
BCD
2016+
SOT163
2600
只做原装,假一罚十,公司可开17%增值税发票!
询价
BCD
24+
SOT163
5000
只做原装公司现货
询价
BCD
24+
SOT-23-6
393428
背光IC原装现货热卖中
询价
BCD
17PB
SOT163
5800
现货
询价
BCD
23+
SOT163
50000
全新原装正品现货,支持订货
询价
更多AP3024PP供应商 更新时间2025-7-24 10:19:00