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零件编号	下载订购	功能描述/丝印	制造商上传企业	LOGO
CDBS0130	文件：61.59 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0805(2012)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method202	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBS0130	文件：147.9 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0130	文件：65.7 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0130-HF	文件：199.83 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lowstoredcharge. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderabl	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP

更多AP0130供应商更新时间2025-7-22 17:22:00