首页>AM625SIP>规格书详情

AM625SIP中文资料与 Arm® Cortex®-A53 和集成 LPDDR4 封装在一起的通用系统数据手册TI规格书

PDF无图
厂商型号

AM625SIP

功能描述

与 Arm® Cortex®-A53 和集成 LPDDR4 封装在一起的通用系统

制造商

TI Texas Instruments

中文名称

德州仪器

数据手册

下载地址下载地址二

更新时间

2025-10-10 10:16:00

人工找货

AM625SIP价格和库存,欢迎联系客服免费人工找货

AM625SIP规格书详情

描述 Description

AM625SIP is a System In Package (SIP) derivative of the ALW packaged AM6254 device, with the addition of an integrated LPDDR4 SDRAM. This document only defines differences or exceptions to the ALW packaged AM6254 device defined in AM62x Sitara Processors Datasheet (revision B or later).

The AM625SIP (System in Package) Sitara™ MPU with integrated LPDDR4 is an application processor built for Linux development. The system in package integrates 512MB of LPDDR4 with the AM6254 device which has 4x Arm® Cortex®-A53 performance and embedded features, such as: dual-display support, 3D graphics acceleration, along with an extensive set of peripherals that make the System in package well-suited for a broad range of industrial applications while offering intelligent features and optimized power architecture. Additionally, the AM625SIP offers a simplified hardware design, increased robustness, optimized size/system BOM, and power consumption savings all enabling faster software and hardware development.

Some of these applications include:

Industrial HMI Medical equipment, Patient monitoring, and Portable medical devices Smart home gateways & Appliances Embedded security: Control & Access panels The 3-port Gigabit Ethernet switch has one internal port and two external ports with Time-Sensitive Networking (TSN) support. An additional PRU module on the device enables real-time I/O capability for customer’s own use cases. In addition, the extensive set of peripherals included in AM625SIP enables system-level connectivity, such as: USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external ASIC/FPGA. The AM625SIP device also supports secure boot for IP protection with the built-in Hardware Security Module (HSM) and employs advanced power management support for portable and power-sensitive applications

特性 Features

Processor Cores:

Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4 GHz

Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC

Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection



Single-core Arm® Cortex®-M4F MCU at up to 400 MHz

256KB SRAM with SECDED ECC



Dedicated Device/Power Manager

Multimedia:

Display subsystem

Dual display support

1920x1080 @ 60fps for each display

1x 2048x1080 + 1x 1280x720

Up to 165 MHz pixel clock support with Independent PLL for each display

OLDI (4 lanes LVDS - 2x) and DPI (24-bit RGB LVCMOS)

Support safety feature such as freeze frame detection and MISR data check



3D Graphics Processing Unit

1 pixel per clock or higher

Fillrate greater than 500 Mpixels/sec

>500 MTexels/s, >8 GFLOPs

Supports at least 2 composition layers

Supports up to 2048x1080 @60fps

Supports ARGB32, RGB565 and YUV formats

2D graphics capable

OpenGL ES 3.1, Vulkan 1.2



One Camera Serial interface (CSI-Rx) - 4 Lane with DPHY

MIPI CSI-2 v1.3 Compliant + MIPI D-PHY 1.2

Support for 1,2,3 or 4 data lane mode up to 1.5Gbps per lane

ECC verification/correction with CRC check + ECC on RAM

Virtual Channel support (up to 16)

Ability to write stream data directly to DDR via DMA



Memory Subsystem:

Up to 816KB of On-chip RAM

64KB of On-chip RAM (OCSRAM) with SECDED ECC , Can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks

256KB of On-chip RAM with SECDED ECC in SMS Subsystem

176KB of On-chip RAM with SECDED ECC in SMS Subsystem for TI security firmware

256KB of On-chip RAM with SECDED ECC in Cortex-M4F MCU subsystem

64KB of On-chip RAM with SECDED ECC in Device/Power Manager Subsystem



DDR Subsystem (DDRSS)

Integrated 512MB LPDDR4 SDRAM

Supports speeds up to 1600 MT/s

16-Bit data bus with inline ECC



Security:

Secure boot supported

Hardware-enforced Root-of-Trust (RoT)

Support to switch RoT via backup key

Support for takeover protection, IP protection, and anti-roll back protection



Trusted Execution Environment (TEE) supported

Arm TrustZone based TEE

Extensive firewall support for isolation

Secure watchdog/timer/IPC

Secure storage support

Replay Protected Memory Block (RPMB) support



Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing

Cryptographic acceleration supported

Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream

Supports cryptographic cores



AES – 128-/192-/256-Bit key sizes

SHA2 – 224-/256-/384-/512-Bit key sizes

DRBG with true random number generator

PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot



Debugging security

Secure software controlled debug access

Security aware debugging



PRU Subsystem:

Dual-core Programmable Real-Time Unit Subystem (PRUSS) running up to 333 MHz

Intended for driving GPIO for cycle accurate protocols such as additional:

General Purpose Input/Output (GPIO)

UARTs

I 2C

External ADC



16KByte program memory per PRU with SECDED ECC

8KB data memory per PRU with SECDED ECC

32KB general purpose memory with SECDED ECC

CRC32/16 HW accelerator

Scratch PAD memory with 3 banks of 30 x 32-bit registers

1 Industrial 64-bit timer with 9 capture and 16 compare events, along with slow and fast compensation

1 interrupt controller (INTC), minimum of 64 input events supported

High-Speed Interfaces:

Integrated Ethernet switch supporting (total of 2 external ports)

RMII(10/100) or RGMII (10/100/1000)

IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)

Clause 45 MDIO PHY management

Packet Classifier based on ALE engine with 512 classifiers

Priority based flow control

Time sensitive networking (TSN) support

Four CPU H/W interrupt Pacing

IP/UDP/TCP checksum offload in hardware



Two USB2.0 Ports

Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)

Integrated USB VBUS detection



General Connectivity:

9x Universal Asynchronous Receiver-Transmitters (UART)

5x Serial Peripheral Interface (SPI) controllers

6x Inter-Integrated Circuit (I 2C) ports

3x Multichannel Audio Serial Ports (McASP)

Transmit and Receive Clocks up to 50 MHz

Up to 16/10/6 Serial Data Pins across 3x McASP with Independent TX and RX Clocks

Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats

Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)

FIFO Buffers for Transmit and Receive (256 Bytes)

Support for audio reference output clock



3x enhanced PWM modules (ePWM)

3x enhanced Quadrature Encoder Pulse modules (eQEP)

3x enhanced Capture modules (eCAP)

General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO

3x Controller Area Network (CAN) modules with CAN-FD support

Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1

Full CAN FD support (up to 64 data bytes)

Parity/ECC check for Message RAM

Speed up to 8Mbps



Media and Data Storage:

3x Multi-Media Card/Secure Digital (MMC/SD/SDIO) interface

1x 8-bit eMMC interface up to HS200 speed

2x 4-bit SD/SDIO interface up to UHS-I

Compliant with eMMC 5.1, SD 3.0 and SDIO Version 3.0



1× General-Purpose Memory Controller (GPMC) up to 133 MHz

Flexible 8- and 16-Bit Asynchronous Memory Interface With up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)

Uses BCH Code to Support 4-, 8-, or 16-Bit ECC

Uses Hamming Code to Support 1-Bit ECC

Error Locator Module (ELM)

Used With the GPMC to Locate Addresses of Data Errors From Syndrome Polynomials Generated Using a BCH Algorithm

Supports 4-, 8-, and 16-Bit Per 512-Byte Block Error Location Based on BCH Algorithms





OSPI/QSPI with DDR / SDR support

Support for Serial NAND and Serial NOR flash devices

4GBytes memory address support

XIP mode with optional on-the-fly encryption



Power Management:

Low power modes supported by Device/Power Manager

Partial IO support for CAN/GPIO/UART wakeup

DeepSleep

MCU Only

Standby

Dynamic frequency scaling for Cortex-A53



Optimal Power Management Solution:

Recommended TPS65219 Power Management ICs (PMIC)

Companion PMIC specially designed to meet device power supply requirements

Flexible mapping and factory programmed configurations to support different use cases



Boot Options:

UART

I 2C EEPROM

OSPI/QSPI Flash

GPMC NOR/NAND Flash

Serial NAND Flash

SD Card

eMMC

USB (host) boot from Mass Storage device

USB (device) boot from external host (DFU mode)

Ethernet

Technology / Package:

16-nm technology

13 mm x 13 mm, 0.5-mm pitch, 425-pin FCCSP BGA (AMK)

技术参数

  • 制造商编号

    :AM625SIP

  • 生产厂家

    :TI

  • Arm (max) (MHz)

    :1400

  • Coprocessors

    :1 Arm Cortex-M4F

  • CPU

    :64-bit

  • Graphics acceleration

    :1 3D

  • Display type

    :MIPI DPI

  • Protocols

    :Ethernet

  • Ethernet MAC

    :2-Port 10/100/1000

  • Hardware accelerators

    :PRU-SS

  • Features

    :General purpose

  • Operating system

    :Linux

  • Security

    :Secure boot

  • Rating

    :Catalog

  • Power supply solution

    :TPS65219

  • Operating temperature range (°C)

    :-40 to 95

  • 封装

    :FCCSP (AMK)

  • 引脚

    :425

  • 尺寸

    :169 mm² 13 x 13

供应商 型号 品牌 批号 封装 库存 备注 价格
AMTEK
22+
HSOP
8200
全新原装现货!自家库存!
询价
24+
N/A
54000
一级代理-主营优势-实惠价格-不悔选择
询价
Anatech
1653
询价
HIT
25+
SOP28W
3629
原装优势!房间现货!欢迎来电!
询价
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
询价
AMTEK
06+
HSOP
73
全新原装进口自己库存优势
询价
AMTEK
17+
HSOP
9988
只做原装进口,自己库存
询价
AMD
23+
BGA
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
AMTEK
24+
SMD
20000
一级代理原装现货假一罚十
询价
TI/德州仪器
25+
原厂封装
10280
询价