AM625SIP中文资料与 Arm® Cortex®-A53 和集成 LPDDR4 封装在一起的通用系统数据手册TI规格书
AM625SIP规格书详情
描述 Description
AM625SIP is a System In Package (SIP) derivative of the ALW packaged AM6254 device, with the addition of an integrated LPDDR4 SDRAM. This document only defines differences or exceptions to the ALW packaged AM6254 device defined in AM62x Sitara Processors Datasheet (revision B or later).
The AM625SIP (System in Package) Sitara™ MPU with integrated LPDDR4 is an application processor built for Linux development. The system in package integrates 512MB of LPDDR4 with the AM6254 device which has 4x Arm® Cortex®-A53 performance and embedded features, such as: dual-display support, 3D graphics acceleration, along with an extensive set of peripherals that make the System in package well-suited for a broad range of industrial applications while offering intelligent features and optimized power architecture. Additionally, the AM625SIP offers a simplified hardware design, increased robustness, optimized size/system BOM, and power consumption savings all enabling faster software and hardware development.
Some of these applications include:
Industrial HMI Medical equipment, Patient monitoring, and Portable medical devices Smart home gateways & Appliances Embedded security: Control & Access panels The 3-port Gigabit Ethernet switch has one internal port and two external ports with Time-Sensitive Networking (TSN) support. An additional PRU module on the device enables real-time I/O capability for customer’s own use cases. In addition, the extensive set of peripherals included in AM625SIP enables system-level connectivity, such as: USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external ASIC/FPGA. The AM625SIP device also supports secure boot for IP protection with the built-in Hardware Security Module (HSM) and employs advanced power management support for portable and power-sensitive applications
特性 Features
Processor Cores:
Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4 GHz
Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
Single-core Arm® Cortex®-M4F MCU at up to 400 MHz
256KB SRAM with SECDED ECC
Dedicated Device/Power Manager
Multimedia:
Display subsystem
Dual display support
1920x1080 @ 60fps for each display
1x 2048x1080 + 1x 1280x720
Up to 165 MHz pixel clock support with Independent PLL for each display
OLDI (4 lanes LVDS - 2x) and DPI (24-bit RGB LVCMOS)
Support safety feature such as freeze frame detection and MISR data check
3D Graphics Processing Unit
1 pixel per clock or higher
Fillrate greater than 500 Mpixels/sec
>500 MTexels/s, >8 GFLOPs
Supports at least 2 composition layers
Supports up to 2048x1080 @60fps
Supports ARGB32, RGB565 and YUV formats
2D graphics capable
OpenGL ES 3.1, Vulkan 1.2
One Camera Serial interface (CSI-Rx) - 4 Lane with DPHY
MIPI CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
Support for 1,2,3 or 4 data lane mode up to 1.5Gbps per lane
ECC verification/correction with CRC check + ECC on RAM
Virtual Channel support (up to 16)
Ability to write stream data directly to DDR via DMA
Memory Subsystem:
Up to 816KB of On-chip RAM
64KB of On-chip RAM (OCSRAM) with SECDED ECC , Can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks
256KB of On-chip RAM with SECDED ECC in SMS Subsystem
176KB of On-chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
256KB of On-chip RAM with SECDED ECC in Cortex-M4F MCU subsystem
64KB of On-chip RAM with SECDED ECC in Device/Power Manager Subsystem
DDR Subsystem (DDRSS)
Integrated 512MB LPDDR4 SDRAM
Supports speeds up to 1600 MT/s
16-Bit data bus with inline ECC
Security:
Secure boot supported
Hardware-enforced Root-of-Trust (RoT)
Support to switch RoT via backup key
Support for takeover protection, IP protection, and anti-roll back protection
Trusted Execution Environment (TEE) supported
Arm TrustZone based TEE
Extensive firewall support for isolation
Secure watchdog/timer/IPC
Secure storage support
Replay Protected Memory Block (RPMB) support
Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing
Cryptographic acceleration supported
Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
Supports cryptographic cores
AES – 128-/192-/256-Bit key sizes
SHA2 – 224-/256-/384-/512-Bit key sizes
DRBG with true random number generator
PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
Debugging security
Secure software controlled debug access
Security aware debugging
PRU Subsystem:
Dual-core Programmable Real-Time Unit Subystem (PRUSS) running up to 333 MHz
Intended for driving GPIO for cycle accurate protocols such as additional:
General Purpose Input/Output (GPIO)
UARTs
I 2C
External ADC
16KByte program memory per PRU with SECDED ECC
8KB data memory per PRU with SECDED ECC
32KB general purpose memory with SECDED ECC
CRC32/16 HW accelerator
Scratch PAD memory with 3 banks of 30 x 32-bit registers
1 Industrial 64-bit timer with 9 capture and 16 compare events, along with slow and fast compensation
1 interrupt controller (INTC), minimum of 64 input events supported
High-Speed Interfaces:
Integrated Ethernet switch supporting (total of 2 external ports)
RMII(10/100) or RGMII (10/100/1000)
IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
Clause 45 MDIO PHY management
Packet Classifier based on ALE engine with 512 classifiers
Priority based flow control
Time sensitive networking (TSN) support
Four CPU H/W interrupt Pacing
IP/UDP/TCP checksum offload in hardware
Two USB2.0 Ports
Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
Integrated USB VBUS detection
General Connectivity:
9x Universal Asynchronous Receiver-Transmitters (UART)
5x Serial Peripheral Interface (SPI) controllers
6x Inter-Integrated Circuit (I 2C) ports
3x Multichannel Audio Serial Ports (McASP)
Transmit and Receive Clocks up to 50 MHz
Up to 16/10/6 Serial Data Pins across 3x McASP with Independent TX and RX Clocks
Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
FIFO Buffers for Transmit and Receive (256 Bytes)
Support for audio reference output clock
3x enhanced PWM modules (ePWM)
3x enhanced Quadrature Encoder Pulse modules (eQEP)
3x enhanced Capture modules (eCAP)
General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO
3x Controller Area Network (CAN) modules with CAN-FD support
Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1
Full CAN FD support (up to 64 data bytes)
Parity/ECC check for Message RAM
Speed up to 8Mbps
Media and Data Storage:
3x Multi-Media Card/Secure Digital (MMC/SD/SDIO) interface
1x 8-bit eMMC interface up to HS200 speed
2x 4-bit SD/SDIO interface up to UHS-I
Compliant with eMMC 5.1, SD 3.0 and SDIO Version 3.0
1× General-Purpose Memory Controller (GPMC) up to 133 MHz
Flexible 8- and 16-Bit Asynchronous Memory Interface With up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)
Uses BCH Code to Support 4-, 8-, or 16-Bit ECC
Uses Hamming Code to Support 1-Bit ECC
Error Locator Module (ELM)
Used With the GPMC to Locate Addresses of Data Errors From Syndrome Polynomials Generated Using a BCH Algorithm
Supports 4-, 8-, and 16-Bit Per 512-Byte Block Error Location Based on BCH Algorithms
OSPI/QSPI with DDR / SDR support
Support for Serial NAND and Serial NOR flash devices
4GBytes memory address support
XIP mode with optional on-the-fly encryption
Power Management:
Low power modes supported by Device/Power Manager
Partial IO support for CAN/GPIO/UART wakeup
DeepSleep
MCU Only
Standby
Dynamic frequency scaling for Cortex-A53
Optimal Power Management Solution:
Recommended TPS65219 Power Management ICs (PMIC)
Companion PMIC specially designed to meet device power supply requirements
Flexible mapping and factory programmed configurations to support different use cases
Boot Options:
UART
I 2C EEPROM
OSPI/QSPI Flash
GPMC NOR/NAND Flash
Serial NAND Flash
SD Card
eMMC
USB (host) boot from Mass Storage device
USB (device) boot from external host (DFU mode)
Ethernet
Technology / Package:
16-nm technology
13 mm x 13 mm, 0.5-mm pitch, 425-pin FCCSP BGA (AMK)
技术参数
- 制造商编号
:AM625SIP
- 生产厂家
:TI
- Arm (max) (MHz)
:1400
- Coprocessors
:1 Arm Cortex-M4F
- CPU
:64-bit
- Graphics acceleration
:1 3D
- Display type
:MIPI DPI
- Protocols
:Ethernet
- Ethernet MAC
:2-Port 10/100/1000
- Hardware accelerators
:PRU-SS
- Features
:General purpose
- Operating system
:Linux
- Security
:Secure boot
- Rating
:Catalog
- Power supply solution
:TPS65219
- Operating temperature range (°C)
:-40 to 95
- 封装
:FCCSP (AMK)
- 引脚
:425
- 尺寸
:169 mm² 13 x 13
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
AMTEK |
22+ |
HSOP |
8200 |
全新原装现货!自家库存! |
询价 | ||
24+ |
N/A |
54000 |
一级代理-主营优势-实惠价格-不悔选择 |
询价 | |||
Anatech |
1653 |
询价 | |||||
HIT |
25+ |
SOP28W |
3629 |
原装优势!房间现货!欢迎来电! |
询价 | ||
TI/德州仪器 |
25+ |
原厂封装 |
10280 |
原厂授权代理,专注军工、汽车、医疗、工业、新能源! |
询价 | ||
AMTEK |
06+ |
HSOP |
73 |
全新原装进口自己库存优势 |
询价 | ||
AMTEK |
17+ |
HSOP |
9988 |
只做原装进口,自己库存 |
询价 | ||
AMD |
23+ |
BGA |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
询价 | ||
AMTEK |
24+ |
SMD |
20000 |
一级代理原装现货假一罚十 |
询价 | ||
TI/德州仪器 |
25+ |
原厂封装 |
10280 |
询价 |