AF0130CS1M30SMKA1-CR-E中文资料安森美半导体数据手册PDF规格书

特性 Features

 1.2 MP CMOS Smart iToF Sensor with Advanced

3.5 m Pixel Stacked BSI Technology

 Superior Low-Light and Ambient-Light Performance

 Enhanced NIR Response at 850 nm and 940 nm

Wavelength (QE > 40%)

 Dual Laser (Frequency) Operation for Increased Depth

Range (Disambiguation) in VGA Resolution

 Low Voltage Differential Signal (LVDS) Driver for

Modulation Control of Two Lasers up to 200 MHz

 Two or Four-Wire Serial Interface for Register Access

 2 Gbps/Lane, 2-lane MIPI CSI-2 D-PHY Data Interface

 Laser Eye Safety Monitoring

 Three Output Mode: RAW, Data Reduction (DR),

Integrated Depth Processing (DP)

 Phase and Pulsed (Hybrid) Modulation Support

 Simultaneous Depth, Confidence and Grayscale Output

 Horizontal and Vertical Mirroring, Windowing and

Pixel Binning

 Context State Machine with 64 Programmable Contexts

 Automatic Exposure Control (AEC)

 Pixel Identification & Correction (PDI & PDC)

 Multi Camera and Interference Mitigation

 Reduced Motion Artefacts due to Decoupling between

Integration and Readout

 Hardware Trigger Control

 On-Chip Mean and Histogram Statistics for Smart

Control

 On-Chip Temperature Sensor

 These Devices are Pb-Free and RoHS Compliant

Applications

 Computing

 Drones, Robotics & Automation

 Metrology

 Machine Vision

 Future Retail & Intelligent Logistics

 Security & Access Control

 Virtual or Augmented Reality

 3D Modeling