15 AMP SILICON BRIDGE RECTIFIERS

FEATURES ● VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical

文件：462.37 Kbytes 页数：2 Pages

DEC

15 AMP SILICON BRIDGE RECTIFIERS

FEATURES • VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical

文件：476.32 Kbytes 页数：2 Pages

DEC

P-Channel Enhancement Mode Field Effect Transistor

Features: ● Low Gate Charge for Fast Switching Application ● Low RDS(ON) to Minimize Conductive Loss ● 100% EAS Guaranteed ● Optimized V(BR)DSS Ruggedness ● Green Device Available Description: These P-Channel enhancement mode power field effect transistors are using trench DMOS techno

文件：495.02 Kbytes 页数：5 Pages

ADV

爱德微

Bourns® Mini-Breaker Thermal Cutoff Device (TCO) Model SD and AD Series

FEATURES • Resettable overtemperature and overcurrent protection • Can be used as a resettable overtemperature sensor • Trip temperature range of 55 ˚C up to 150 ˚C • High trip temperature accuracy of just ±5 ˚C • Highly repeatable with ratings of up to 10,000 cycles • Surface mount (SD S

文件：686.19 Kbytes 页数：2 Pages

BOURNS

伯恩斯

Blackfin Embedded Processor

GENERAL DESCRIPTION The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are members of the Blackfin family of products, incorporating the Analog Devices/Intel Micro Signal Architecture (MSA). Black fin processors combine a dual-MAC state-of-the-art signal processing engine, the advantages of a clea

文件：2.44987 Mbytes 页数：64 Pages

AD

亚德诺

Blackfin Embedded Processor

GENERAL DESCRIPTION The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are members of the Blackfin family of products, incorporating the Analog Devices/Intel Micro Signal Architecture (MSA). Black fin processors combine a dual-MAC state-of-the-art signal processing engine, the advantages of a clea

文件：2.44987 Mbytes 页数：64 Pages

AD

亚德诺

Blackfin Embedded Processor

GENERAL DESCRIPTION The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are members of the Blackfin family of products, incorporating the Analog Devices/Intel Micro Signal Architecture (MSA). Black fin processors combine a dual-MAC state-of-the-art signal processing engine, the advantages of a clea

文件：2.44987 Mbytes 页数：64 Pages

AD

亚德诺

Blackfin Embedded Processor

GENERAL DESCRIPTION The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are members of the Blackfin family of products, incorporating the Analog Devices/Intel Micro Signal Architecture (MSA). Black fin processors combine a dual-MAC state-of-the-art signal processing engine, the advantages of a clea

文件：2.44987 Mbytes 页数：64 Pages

AD

亚德诺

Blackfin Embedded Processor

GENERAL DESCRIPTION The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are members of the Blackfin family of products, incorporating the Analog Devices/Intel Micro Signal Architecture (MSA). Black fin processors combine a dual-MAC state-of-the-art signal processing engine, the advantages of a clea

文件：2.44987 Mbytes 页数：64 Pages

AD

亚德诺

Blackfin Embedded Processor

GENERAL DESCRIPTION The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are members of the Blackfin family of products, incorporating the Analog Devices/Intel Micro Signal Architecture (MSA). Black fin processors combine a dual-MAC state-of-the-art signal processing engine, the advantages of a clea

文件：2.44987 Mbytes 页数：64 Pages

AD

亚德诺