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BX9709

RFAMPLIFIERMODEL

APITECH

API Technologies Corp

DDZ9709

SURFACEMOUNTLOWCURRENTZENERDIODE

Features •500mWPowerDissipationonFR-4PCBatTL=+75°C •SpecifiedataLowTestCurrent(50µA),IdealForLowBiasand PortableBattery-PoweredApplications •IdeallySuitedforAutomatedAssemblyProcesses •TotallyLead-Free&FullyRoHSCompliant(Notes1&2) •Halogen

DIODESDiodes Incorporated

美台半导体

DDZ9709

SURFACEMOUNTPRECISIONZENERDIODE

Features •500mWPowerDissipationonCeramicPCB •TightToleranceonVZ •IdeallySuitedforAutomatedAssemblyProcesses •Lead,HalogenandAntimonyFree,RoHSCompliant(Note2) •GreenDevice(Note3)

DIODESDiodes Incorporated

美台半导体

DDZ9709

SURFACEMOUNTPRECISIONZENERDIODE

Features •500mWPowerDissipationonFR-4PCBatTL=+75°C •SpecifiedataLowTestCurrent(50µA),IdealForLowBiasand PortableBattery-PoweredApplications •IdeallySuitedforAutomatedAssemblyProcesses •TotallyLead-Free&FullyRoHSCompliant(Notes1&2) •Halogen

DIODESDiodes Incorporated

美台半导体

DDZ9709

SURFACEMOUNTLOWCURRENTZENERDIODE

DIODESDiodes Incorporated

美台半导体

DDZ9709

SURFACEMOUNTPRECISIONZENERDIODE

DIODESDiodes Incorporated

美台半导体

DDZ9709S

SURFACEMOUNTPRECISIONZENERDIODE

Features •VerySharpBreakdownCharacteristics •VeryTightToleranceonVZ •IdeallySuitedforAutomatedAssemblyProcesses •VeryLowLeakageCurrent •LeadFreeByDesign/RoHSCompliant(Note1) •“Green”Device(Note2)

DIODESDiodes Incorporated

美台半导体

DDZ9709T

SURFACEMOUNTZENERDIODE

DIODESDiodes Incorporated

美台半导体

DDZ9709T

SURFACEMOUNTPRECISIONZENERDIODE

Features •Small,LowProfileSurfaceMountPackage •VerySharpBreakdownCharacteristics •IdeallySuitedforAutomatedAssemblyProcesses •VeryLowLeakageCurrent •TotallyLead-Free&FullyRoHSCompliant(Notes1&2) •HalogenandAntimonyFree.“Green”Device(Note3)

DIODESDiodes Incorporated

美台半导体

DDZX9709

SURFACEMOUNTPRECISIONZENERDIODE

DIODESDiodes Incorporated

美台半导体

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