Package：196-BGA，CSPBGA；包装：卷带（TR） 类别：RF/IF，射频/中频和 RFID 射频混频器 描述：IC MIXER UP CONVRT 196CSBGA

AD

亚德诺

DirectFET Power MOSFET

Description The IRF6633 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geom

文件：266.71 Kbytes 页数：9 Pages

IRF

RoHs Compliant Containing No Lead and Bromide

Description The IRF6633 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geom

文件：263.73 Kbytes 页数：10 Pages

IRF

RoHS Compliant

Description The IRF6633APbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout

文件：268.81 Kbytes 页数：9 Pages

IRF