丝印：AC11240；Package：SOIC；OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-
m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small-

文件：420.85 Kbytes 页数：16 Pages

TI

德州仪器

丝印：AC11240；Package：SOIC；OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-
m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small-

文件：420.85 Kbytes 页数：16 Pages

TI

德州仪器

Titanum Assembly

文件：104.18 Kbytes 页数：2 Pages

LEDIL

~8째 35째 oval beam. Variant with beam direction rotated 90째. Assembly with tape.

文件：2.33174 Mbytes 页数：4 Pages

LEDIL

Breake Away Header .025(0.64mm) Square Posts

[FOXCONN] Breake Away Header .025 (0.64mm) Square Posts

文件：153.19 Kbytes 页数：2 Pages

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