General Description

ProASIC3E, the third-generation family of Microsemi flash FPGAs, offers performance, density, and features beyond those of the ProASICPLUS® family. Nonvolatile flash technology gives ProASIC3E devices the advantage of being a secure, low power, single-chip solution that is Instant On. ProASIC3E is reprogrammable and offers time-to-market benefits at an ASIC-level unit cost. These features enable designers to create high-density systems using existing ASIC or FPGA design flows and tools.

Features and Benefits

High Capacity

• 600 k to 3 Million System Gates

• 108 to 504 kbits of True Dual-Port SRAM

• Up to 620 User I/Os

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

• Instant On Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

On-Chip User Nonvolatile Memory

• 1 kbit of FlashROM with Synchronous Interfacing

High Performance

• 350 MHz System Performance

• 3.3 V, 66 MHz 64-Bit PCI

In-System Programming (ISP) and Security

• ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption via JTAG (IEEE 1532–compliant)

• FlashLock® Designed to Secure FPGA Contents

Low Power

• Core Voltage for Low Power

• Support for 1.5-V-Only Systems

• Low-Impedance Flash Switches

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

• Ultra-Fast Local and Long-Line Network

• Enhanced High-Speed, Very-Long-Line Network

• High-Performance, Low-Skew Global Network

• Architecture Supports Ultra-High Utilization

Pro (Professional) I/O

• 700 Mbps DDR, LVDS-Capable I/Os

• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Bank-Selectable I/O Voltages—up to 8 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS 2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS

• Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL 2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3 Class I and II

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold Sparing I/Os

• Programmable Output Slew Rate and Drive Strength

• Programmable Input Delay

• Schmitt Trigger Option on Single-Ended Inputs

• Weak Pull-Up/-Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the ProASIC®3E Family

Clock Conditioning Circuit (CCC) and PLL

• Six CCC Blocks, Each with an Integrated PLL

• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback

• Wide Input Frequency Range (1.5 MHz to 350 MHz)

SRAMs and FIFOs

• Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations available)

• True Dual-Port SRAM (except ×18)

• 24 SRAM and FIFO Configurations with Synchronous Operation up to 350 MHz

ARM® Processor Support in ProASIC3E FPGAs

• M1 ProASIC3E Devices—Cortex-M1 Soft Processor Available with or without Debug

A3PE600-2PQ208I属于集成电路（IC） > FPGA（现场可编程门阵列）。美高森美公司制造生产的A3PE600-2PQ208IFPGA（现场可编程门阵列）FPGA 是用于执行逻辑运算和信息处理的用户可配置集成电路产品，通常具有非常高级别的集成功能。这些器件通常用于代替通用微处理器，其中已知运算将以极高的速度执行，例如用于接收和处理来自高速数据转换器的信息。它们通常需要外部存储设备来存储用户所需的配置，并在启动时重新加载这些配置。