ACEPACK 2 power module, fourpack topology, 1200 V, 13 mΩ typ. SiC Power MOSFET gen.2 with NTC

Features • Fourpack topology • ACEPACK 2 power module – 13 mΩ of typical RDS(on) each switch – Insulation voltage UL certified of 2.5 kVrms – Integrated NTC temperature sensor – DBC Cu-Al2O3-Cu based – Press fit contact pins Description This ACEPACK 2 power module in fourpack topology i

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STMICROELECTRONICS

意法半导体

ACEPACK 2电源模块四单元拓扑，1200V，13mOhm典型值，配备NTC的第二代SiC Power MOFET

This ACEPACK 2 power module in fourpack topology integrates advanced silicon carbide Power MOSFET technology from STMicroelectronics. The module leverages the innovative properties of the wide-bandgap SiC material and a high-thermal-performance substrate. The result is exceptionally low on-resistanc • Fourpack topology \n• ACEPACK 2 power module \n •13 mΩ of typical RDS(on) each switch \n •Insulation voltage UL certified of 2.5 kVrms \n •Integrated NTC temperature sensor \n •DBC Cu-Al2O3-Cu based \n •Press-fit contact pins;

ST

意法半导体

Package：模块；包装：管件 类别：分立半导体产品 晶体管 - IGBT - 模块 描述：ACEPACK 2 POWER MODULE, FOURPACK

STMICROELECTRONICS

意法半导体

MICROCHIP/微芯
BGA484

MICROCHIP/微芯

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