Ultra-Large band Wire Bondable Vertical SiCap UWSC832.410 0101 1nF BV30

Compatible with MLCC footprint  Ultra-high stability of capacitace value: o Temperature 70ppm/K (-55 °C to +150 °C) o Voltage

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MuRata

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Ultra-Large band Wire Bondable Vertical SiCap UWSC 0101 1nF BV30

• Break down voltage: 30V • Low leakage current • High reliability • High operating temperature (up to 150 °C) • Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C) • Compatible with EIA 0101 footprint • Applicable for standard wire bonding assembly (b

文件：1.16571 Mbytes 页数：11 Pages

MuRata

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Package：非标准型芯片；包装：托盘 类别：电容器 硅电容器 描述：CAP SILICON 1000PF 15% 30V SMD

MURATA1

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上传：北京京北通宇电子元件有限公司