Ultra-Large band Wire Bondable Vertical SiCap UWSC632.410 0101 1nF BV50

Compatible with MLCC footprint Ultra-high stability of capacitance value: o Temperature 70ppm/K (-55 °C to+150 °C) o Voltage

文件：1.17521 Mbytes 页数：10 Pages

MuRata

村田

Ultra-Large band Wire Bondable Vertical SiCap UWSC 0101 1nF BV50

• Break down voltage 50V • Low leakage current • High reliability • High operating temperature (up to 150 °C) • Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C) • Compatible with EIA 0101+ footprint • Applicable for standard wire bonding assem

文件：758.61 Kbytes 页数：10 Pages

MuRata

村田

Ultra-Large band Wire Bondable Vertical SiCap UWSC 0101 1nF BV50

• Break down voltage 50V • Low leakage current • High reliability • High operating temperature (up to 150 °C) • Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C) • Compatible with EIA 0101+ footprint • Applicable for standard wire bonding assem

文件：758.61 Kbytes 页数：10 Pages

MuRata

村田

Reel

TE

上传：北京京北通宇电子元件有限公司

Reel

TE

上传：北京京北通宇电子元件有限公司