Wire Bondable Vertical SiCap WLSC832.410 0101 1nF BV30

 Compatible with MLCC footprint  Ultra-high stability of capacitance value: o Temperature 70ppm/K (-55 °C to +150 °C) o Voltage

文件：1.24866 Mbytes 页数：11 Pages

MuRata

村田

Wire Bondable Vertical SiCap WLSC 0101 1nF BV30

 Break down voltage: 30V  Low leakage current  High reliability  High operating temperature (up to 150 °C)  Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C)  Compatible with EIA 0101 footprint  Applicable for standard wire bonding assembly

文件：1.3674 Mbytes 页数：11 Pages

MuRata

村田

Wire Bondable Vertical SiCap WLSC 0101 1nF BV30

 Break down voltage: 30V  Low leakage current  High reliability  High operating temperature (up to 150 °C)  Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C)  Compatible with EIA 0101 footprint  Applicable for standard wire bonding assembly

文件：1.3674 Mbytes 页数：11 Pages

MuRata

村田

MUR

上传：深圳市铨博晟科技有限公司

Reel

TE

上传：北京京北通宇电子元件有限公司