935146632322-F1T中文资料村田数据手册PDF规格书

 Compatible with MLCC footprint

 Ultra-high stability of capacitance value:

o Temperature 70ppm/K (-55 °C to

+150 °C)

o Voltage <-0.02/Volt

o Negligible capacitance loss

through ageing

 Low profile 0.1mm

 Small size 0.25 x 0.25 mm (0101 format)

 Break down voltage : 50V

 Low leakage current

 High reliability

 High operating temperature (up to 150 °C)

 Compatible with high temperature cyclingduring manufacturing operations(exceeding 300 °C)

 Compatible with EIA 0101 footprint

 Applicable for standard wire bondingassembly (ball and wedge)