 Compatible with MLCC footprint

 Ultra-high stability of capacitance value:

o Temperature 70ppm/K (-55 °C to +150 °C)

o Voltage <0.02/Volt

o Negligible capacitance loss through ageing

 Low profile 0.1mm

 Small size 0.5 x 0.25 mm (0201 format) Break down voltage : 150V

 Low leakage current

 High reliability

 High operating temperature (up to 150 °C)

 Compatible with high temperature cycling

during manufacturing operations (exceeding 300 °C)

 Compatible with EIA 0201 footprint

 Applicable for standard wire bonding assembly (ball and wedge)