Wire Bondable Vertical SiCap WLSC 0101 220pF BV50

 Compatible with MLCC footprint  Ultra-high stability of capacitance value: o Temperature 70ppm/K (-55 °C to +150 °C) o Voltage

文件：1.09131 Mbytes 页数：10 Pages

MURATA

村田

Wire Bondable Vertical SiCap WLSC 0101 220pF BV50

• Break down voltage: 50V • Low leakage current • High reliability • High operating temperature (up to 150 °C) • Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C) • Compatible with EIA 0101 footprint • Applicable for standard wire bonding assembly (b

文件：701.76 Kbytes 页数：10 Pages

MURATA

村田

MUR

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Reel

TE

上传：北京京北通宇电子元件有限公司

TE Connectivity

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