Wire Bondable Vertical SiCap WLSC0101 100pF BV150

• Compatible with MLCC footprint • Ultra-high stability of capacitance value: o Temperature 70ppm/K (-55 °C to +150 °C) o Voltage

文件：903.07 Kbytes 页数：3 Pages

MuRata

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Wire Bondable Vertical SiCap WLSC0101 100pF BV150

• Break down voltage: 150V • Low leakage current • High reliability • High operating temperature (up to 150 °C) • Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C) • Compatible with EIA 0101 footprint • Applicable for standard wire bonding assembly (

文件：721.81 Kbytes 页数：10 Pages

MuRata

村田

Wire Bondable Vertical SiCap WLSC0101 100pF BV150

• Break down voltage: 150V • Low leakage current • High reliability • High operating temperature (up to 150 °C) • Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C) • Compatible with EIA 0101 footprint • Applicable for standard wire bonding assembly (

文件：721.81 Kbytes 页数：10 Pages

MuRata

村田

MUR

MUR

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上传：北京京北通宇电子元件有限公司