Wire Bondable Vertical SiCap WLSC0101 100pF BV150

• Compatible with MLCC footprint • Ultra-high stability of capacitance value: o Temperature 70ppm/K (-55 °C to +150 °C) o Voltage

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村田

Wire Bondable Vertical SiCap WLSC0101 100pF BV150

• Break down voltage: 150V • Low leakage current • High reliability • High operating temperature (up to 150 °C) • Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C) • Compatible with EIA 0101 footprint • Applicable for standard wire bonding assembly (

文件：721.81 Kbytes 页数：10 Pages

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村田

MUR

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TE

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TE Connectivity

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