837 Series High Temp Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator

Features 0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Card Slot Depth of .330 (8.38mm) Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend

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EDAC

亚得电子

Modulink??880MP Series Floor Boxes

文件：1.63514 Mbytes 页数：8 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

Modulink??880MP Series Floor Boxes

文件：1.63514 Mbytes 页数：8 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

Modulink??880MP Series Floor Boxes

文件：1.63514 Mbytes 页数：8 Pages

ETCList of Unclassifed Manufacturers

未分类制造商