丝印：75R040M1；Package：PG-HDSOP-22；CoolSiCª Power Device 750 V G1

Features • Highly robust 750V technology, 100% avalanche tested • Best-in-class RDS(on) x Qfr • Excellent RDS(on) x Qoss and RDS(on) x QG • Unique combination of low Crss/Ciss and high VGS(th) • Infineon proprietary die attach technology • Cutting edge top side cooling package (QDPAK) •

文件：1.31725 Mbytes 页数：15 Pages

INFINEON

英飞凌

丝印：75R040M1；Package：PG-TO247-4；MOSFET CoolSiCª Power Device 750 V G1

Features • Highly robust 750V technology, 100% avalanche tested • Best-in-class RDS(on) x Qfr • Excellent RDS(on) x Qoss and RDS(on) x QG • Unique combination of low Crss/Ciss and high VGS(th) • Infineon proprietary die attach technology • Driver source pin available Benefits • Enhan

文件：1.48754 Mbytes 页数：15 Pages

INFINEON

英飞凌

BL75R04

BL75R04

文件：256.13 Kbytes 页数：5 Pages

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BL75R04SM is a ISO15693 full-compliant IC for intelligent label application

Description BL75R04SM is a ISO15693 full-compliant IC for intelligent label application like retail as well as baggage and parcel identification in airline business and mail services, access control, ticketing, product authentication, livestock ID, document tracking. The operating frequency of th

文件：144.78 Kbytes 页数：3 Pages

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