| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
Marking：75R008M1；Package：PG-HDSOP-22；CoolSiCª Power Device 750 V G1 Features •Highlyrobust750Vtechnology,100%avalanchetested •Best-in-classRDS(on)xQfr •ExcellentRDS(on)xQossandRDS(on)xQG •UniquecombinationoflowCrss/CissandhighVGS(th) •Infineonproprietarydieattachtechnology •Cuttingedgetopsidecoolingpackage(QDPAK) • | InfineonInfineon Technologies AG 英飞凌英飞凌科技股份公司 | Infineon | ||
Marking：75R008M1；Package：PG-TO247-4；CoolSiC™ M1 CoolSiC™ Power Device 750 V G1 Features •Highlyrobust750Vtechnology,100%avalanchetested •Best‑in‑classRDS(on)xQfr •ExcellentRDS(on)xQossandRDS(on)xQG •UniquecombinationoflowCrss/CissandhighVGS(th) •Infineonproprietarydieattachtechnology •Driversourcepinavailable •Best‑in‑classRDS | InfineonInfineon Technologies AG 英飞凌英飞凌科技股份公司 | Infineon |
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