丝印：75R027M1；Package：PG-HDSOP-22；MOSFET CoolSiCª Power Device 750 V G1

Features • Highly robust 750V technology, 100% avalanche tested • Best-in-class RDS(on) x Qfr • Excellent RDS(on) x Qoss and RDS(on) x QG • Unique combination of low Crss/Ciss and high VGS(th) • Infineon proprietary die attach technology • Cutting edge top side cooling package (QDPAK) •

文件：1.35586 Mbytes 页数：15 Pages

Infineon

英飞凌

丝印：75R027M1；Package：PG-TO247-4；MOSFET CoolSiCª Power Device 750 V G1

Features • Highly robust 750V technology, 100% avalanche tested • Best-in-class RDS(on) x Qfr • Excellent RDS(on) x Qoss and RDS(on) x QG • Unique combination of low Crss/Ciss and high VGS(th) • Infineon proprietary die attach technology • Driver source pin available Benefits • Enhan

文件：1.52296 Mbytes 页数：15 Pages

Infineon

英飞凌