首页 >74BCT543DW>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
OCTALREGISTEREDTRANSCEIVERSWITH3-STATEOUTPUTS State-of-the-ArtBiCMOSDesign SignificantlyReducesICCZ 3-StateTrueOutputs Back-to-BackRegistersforStorage ESDProtectionExceeds2000V PerMIL-STD-883C,Method3015 PackageOptionsIncludePlastic Small-OutlinePackages(DW),Ceramic ChipCarriers(FK)andFlatpacks(W),and Plas | TI2Texas Instruments 德州仪器美国德州仪器公司 | TI2 | ||
OCTALREGISTEREDTRANSCEIVERSWITH3-STATEOUTPUTS | TITexas Instruments 德州仪器美国德州仪器公司 | TI | ||
OCTALREGISTEREDTRANSCEIVERSWITH3-STATEOUTPUTS | TITexas Instruments 德州仪器美国德州仪器公司 | TI | ||
OCTALREGISTEREDTRANSCEIVERSWITH3-STATEOUTPUTS | TITexas Instruments 德州仪器美国德州仪器公司 | TI | ||
OCTALREGISTEREDTRANSCEIVERSWITH3-STATEOUTPUTS | TITexas Instruments 德州仪器美国德州仪器公司 | TI | ||
OCTALREGISTEREDTRANSCEIVERSWITH3-STATEOUTPUTS | TITexas Instruments 德州仪器美国德州仪器公司 | TI | ||
OCTALREGISTEREDTRANSCEIVERSWITH3-STATEOUTPUTS | TITexas Instruments 德州仪器美国德州仪器公司 | TI | ||
OCTALREGISTEREDTRANSCEIVERSWITH3-STATEOUTPUTS State-of-the-ArtBiCMOSDesign SignificantlyReducesICCZ 3-StateTrueOutputs Back-to-BackRegistersforStorage ESDProtectionExceeds2000V PerMIL-STD-883C,Method3015 PackageOptionsIncludePlastic Small-OutlinePackages(DW),Ceramic ChipCarriers(FK)andFlatpacks(W),and Plas | TI2Texas Instruments 德州仪器美国德州仪器公司 | TI2 | ||
OCTALREGISTEREDTRANSCEIVERSWITH3-STATEOUTPUTS State-of-the-ArtBiCMOSDesign SignificantlyReducesICCZ 3-StateTrueOutputs Back-to-BackRegistersforStorage ESDProtectionExceeds2000V PerMIL-STD-883C,Method3015 PackageOptionsIncludePlastic Small-OutlinePackages(DW),Ceramic ChipCarriers(FK)andFlatpacks(W),and Plas | TI2Texas Instruments 德州仪器美国德州仪器公司 | TI2 | ||
OCTALREGISTEREDTRANSCEIVERSWITH3-STATEOUTPUTS | TITexas Instruments 德州仪器美国德州仪器公司 | TI |
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